Apparatus and method for laminating a first and second sheet

Autor: Brand, J. van den, Dietzel, A.H., Broers, S.C., Saalmink, M.

The invention relates to an apparatus for laminating a first and a second sheet with a plane carrier (10) and a drum shaped carrier (20) for carrying a respective sheet. The apparatus has a first main operational mode wherein the drum shaped carrier

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::4ad162b5fb1e66ced624cf1fdc356d86
http://resolver.tudelft.nl/uuid:f789c548-7081-4d1a-8aa8-db1f8f73f0eb

Large-Field Ion-Optics for Projection and Proximity Printing and for Mask-Less Lithography (ML2)

Autor: Loeschner, H., Stengl, G., Buschbeck, H., Chalupka, A., Lammer, G., Platzgummer, E., Vonach, H., Jager, de, P.W.H., Kaesmaier, R., Ehrmann, A., Hirscher, S., Wolter, A., Dietzel, A.H., Berger, R., Grimm, H., Terris, B.D., Bruenger, W.H., Adam, D., Boehm, M., Eichhorn, H., Springer, R., Butschke, J., Letzkus, F., Ruchhoeft, P., Wolfe, J.C., Engelstad, R.L.

Publikováno v: Emerging Lithographic Technologies VI, Santa Clara, 2002, 595-606
STARTPAGE=595;ENDPAGE=606;TITLE=Emerging Lithographic Technologies VI, Santa Clara, 2002

Recent studies carried out with Infineon Technologies have shown the utility of Ion Projection Lithography (IPL) for the manufacturing of integrated circuits. In cooperation with IBM Storage Technology Division the patterning of magnetic films by res

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b05634122368f198bd303bb9a17cc43d
https://doi.org/10.1117/12.472336

System-in-foil technology

Autor: Dietzel, A.H., Brand, van den, J., Vanfleteren, J., Christiaens, W., Bosman, E., Baets, de, J., Burghartz, J.N.

Publikováno v: Ultra-thin chip technology and applications, 141-158
STARTPAGE=141;ENDPAGE=158;TITLE=Ultra-thin chip technology and applications
Ultra-thin Chip Technology and Applications ISBN: 9781441972750

Systems-in-foil are an emerging new class of flexible electronic products in which complete systems are integrated in thin polymeric foils. First, a brief overview of the basic material choices and fabrication concepts will be given. Then, more detai

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::43248199d004c37e846dfacb5e63066c
https://research.tue.nl/en/publications/806aa32d-aae7-4634-8538-f04147a4a227

Experimental validation of a novel particle separation mechanism using AC electroosmosis

Autor: van der Donk, D.J.H.N., Frijns, A.J.H., Liu, Z., Derks, R.J.S., Dietzel, A.H.

Publikováno v: Microfluidics 2010 : Proceedings of the 2nd European Conference on Microfluidics (µFlu'10) 9-10 December 2010, Toulouse, France

The goal of this paper is to validate experimentally the ability to separate or upconcentrate micro particles inside micro channels using alternating current electro osmosis (ACEO). A novel device has been made containing a microchannel with interdig

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=narcis______::15f81159c07aaba22050a2688fdf445e
https://research.tue.nl/nl/publications/71bfc33a-671f-4ec4-9c86-0294b2217fa1

Novel interconnection processes for low cost PEN/PET substrates

Autor: Brand, J. van den, Kusters, R., Fledderus, H., Rubingh, J.E.J.M., Podprocky, T., Dietzel, A.H.

Publikováno v: European Microelectronics and Packaging Conference, EMPC 2009, 15-18 June 2009, Rimini, Italy

Recently a new class of flexible electronics is starting to emerge which is most effectively termed 'printed electronics'. This term often refers to all-printed, cost effective, smart electronic products that will find a wide range of applications in

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::e4c13fbfd333a9313b88463015d0a99a
http://resolver.tudelft.nl/uuid:605680ff-13f5-45e1-8663-06212f7646e6