Zobrazeno 1 - 10
of 28
pro vyhledávání: '"Dietmar Kieslinger"'
Autor:
Reinhard Kaindl, Tushar Gupta, Alexander Blümel, Songfeng Pei, Peng-Xiang Hou, Jinhong Du, Chang Liu, Paul Patter, Karl Popovic, David Dergez, Kenan Elibol, Erhard Schafler, Johan Liu, Dominik Eder, Dietmar Kieslinger, Wencai Ren, Paul Hartmann, Wolfgang Waldhauser, Bernhard C. Bayer
Publikováno v:
ACS Omega, Vol 6, Iss 50, Pp 34301-34313 (2021)
Externí odkaz:
https://doaj.org/article/7f6ac5adcd164755a7ad60b24928b643
Publikováno v:
Materials & Design, Vol 212, Iss , Pp 110258- (2021)
The formation of microporosity during solidification of Sn-Bi alloys is investigated through experiments and simulations. Samples of varying composition with 20, 30, 47 and 58 wt% Bi are solidified in a copper mould and the pore fraction is measured
Externí odkaz:
https://doaj.org/article/365fafce1995480c837651cde40a13c2
Autor:
Georg Siroky, Elke Kraker, Dietmar Kieslinger, Lorenz Romaner, Ernst Kozeschnik, Werner Ecker
Publikováno v:
Proceedings, Vol 56, Iss 1, p 29 (2020)
This work simulates the collapse of a spherical void in pure Sn during melting using molecular dynamics (MD). Simulations were performed for two temperatures with a modified embedded atom method (MEAM) potential, which was reported to be in good agre
Externí odkaz:
https://doaj.org/article/cc6451ba22c749b68349803980aca4c6
Publikováno v:
International Journal of Damage Mechanics. 30:123-144
This work presents a damage evolution framework including liquid-assisted healing. The model incorporates contributions from void size, void pressure, surface tension and liquid pressure. Experimental motivation for the damage-healing model is provid
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e328b751d802345d79642ce9a8ff908a
https://doi.org/10.1177/1056789520948561
https://doi.org/10.1177/1056789520948561
Autor:
Georg Siroky, Elke Kraker, Sybrand van der Zwaag, Dietmar Kieslinger, Jördis Rosc, Werner Ecker, Ernst Kozeschnik, Roland Brunner
Publikováno v:
Materials, Vol 14, Iss 153, p 153 (2021)
Materials; Volume 14; Issue 1; Pages: 153
Materials, 14(1)
Materials
Materials; Volume 14; Issue 1; Pages: 153
Materials, 14(1)
Materials
This work provides an analysis of X-ray micro computed tomography data of Sn-xBi solders with x = 20, 30, 35, 47, 58 wt.% Bi. The eutectic thickness, fraction of eutectic and primary phase are analyzed. Furthermore, the 3D data is evaluated by means
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ead79f3b5944fe7044c1fc160a721076
https://www.mdpi.com/1996-1944/14/1/153
https://www.mdpi.com/1996-1944/14/1/153
Autor:
Werner Ecker, Georg Siroky, Elke Kraker, Dietmar Kieslinger, Lorenz Romaner, Ernst Kozeschnik
Publikováno v:
Proceedings, Vol 56, Iss 29, p 29 (2020)
This work simulates the collapse of a spherical void in pure Sn during melting using molecular dynamics (MD). Simulations were performed for two temperatures with a modified embedded atom method (MEAM) potential, which was reported to be in good agre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f5d353a48122a8aee6639f89b684fd83
https://doi.org/10.3390/proceedings2020056029
https://doi.org/10.3390/proceedings2020056029
Publikováno v:
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
The use of SAC305 solder for connecting electronic components on a printed circuit board is standard for the microelectronics industry. It is well-known that the quality of solder joints decreases when voids are formed, as it impairs the heat dissipa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9921a6c4cf5624128bcf2687a246d9c3
https://doi.org/10.1109/therminic49743.2020.9420508
https://doi.org/10.1109/therminic49743.2020.9420508
Autor:
Julien Magnien, Elke Kraker, David Melinc, Dietmar Kieslinger, Ernst Kozeschnik, Werner Ecker, Georg Siroky
Publikováno v:
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
The effect of liquid-assisted healing (LAH) of solder materials is investigated by means of experiments and numerical modelling. An in-situ heating experiment shows the material transport due to viscous flow into a surface cavity and, thus, motivates
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eb730f6dca54284b934173bf46436188
https://doi.org/10.1109/eurosime48426.2020.9152751
https://doi.org/10.1109/eurosime48426.2020.9152751
Publikováno v:
Materials & Design, Vol 212, Iss, Pp 110258-(2021)
The formation of microporosity during solidification of Sn-Bi alloys is investigated through experiments and simulations. Samples of varying composition with 20, 30, 47 and 58 wt% Bi are solidified in a copper mould and the pore fraction is measured
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cee44463570603e2dca9c00b3cf8f1d2
https://doi.org/10.1016/j.matdes.2021.110258
https://doi.org/10.1016/j.matdes.2021.110258
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
This paper introduces a numerical approach dealing with self-healing of solder materials, with detailed discussion of the damage and healing behavior of solder joints through creep deformation. The description of damage- and subsequent healing proces
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e7969baade2c9abbe81067e19b4c59cb
https://doi.org/10.1109/eurosime.2019.8724583
https://doi.org/10.1109/eurosime.2019.8724583