Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Dietmar Ganz"'
Publikováno v:
Solar Energy Materials and Solar Cells. 54:287-296
SnO 2 : Sb single and multilayer coatings have been prepared by the sol–gel dip and spin coating method, and by spray pyrolysis from various precursor solutions. Subsequently, the films have been heat treated in a convection furnace or by cw CO 2 l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e3dc76537505e05e47b0f196d9cb72db
https://doi.org/10.1016/s0927-0248(98)00080-4
https://doi.org/10.1016/s0927-0248(98)00080-4
Publikováno v:
Journal of Sol-Gel Science and Technology. 13:1005-1010
Sol-gel dip-coated films of transparent conducting antimony-doped tin oxide (SnO2 : Sb) have been heat treated with heating rates varying from 0.2 to 4300 K/s using either a furnace or cw CO2 laser irradiation. The final sintering temperature of 540
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::559101bc92eccc3b10045d0f49cd7cdb
https://doi.org/10.1023/a:1008660331707
https://doi.org/10.1023/a:1008660331707
Publikováno v:
Journal of Non-Crystalline Solids. 218:242-246
Sb doped sol—gel SnO2 films were prepared from 0.5 M alcoholic solution of SnCl2(OAc)2 doped with 5 mol% SbCl3 and deposited via a dip coating process on fused silica substrates. The coatings have been fired by CO2 laser irradiation by means of a 7
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5d25db38564ff21085ab4e76627d0c40
https://doi.org/10.1016/s0022-3093(97)00166-x
https://doi.org/10.1016/s0022-3093(97)00166-x
Transparent electrically conducting SnO 2 :Sb coatings have been prepared by the sol—gel dip-coating process from an ethanolic solution of SnCl 2 (OAc) 2 and SbCl 3 (5 mol%). The room temperature resistivity of the dip-coated films heat treated in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0b4383d3bd6e50932c4e9c380086ec84
Publikováno v:
Journal of Materials Science Letters. 16:1233-1235
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10e20b1ffc65fd78f86b8a88b89294d6
https://doi.org/10.1023/a:1018546102005
https://doi.org/10.1023/a:1018546102005
Autor:
Sebastian Schmidt, Steffen Hornig, Guenther Hraschan, John Maltabes, Ralf Schuster, Alain Charles, Clint Haris, Dietmar Ganz, Thorsten Schedel, Wolfram Koestler, Karl Mautz
Publikováno v:
SPIE Proceedings.
SEMICONDUCTOR300 was the first pilot production facility for 300mm wafers in the world. This company, a joint venture between Infineon Technologies Motorola, started in early 1998 to develop processes and manufacture products using 300mm wafer tool s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0309709f7b5550c655a46f7285e9750b
https://doi.org/10.1117/12.395736
https://doi.org/10.1117/12.395736
Autor:
Guenther Hraschan, Alain Charles, Sebastian Schmidt, Thomas Metzdorf, Jochen Scheurich, Ralf Otto, Karl Mautz, John Maltabes, Dietmar Ganz, Thorsten Schedel, Ralf Schuster, Steffen Hornig
Publikováno v:
SPIE Proceedings.
SEMICONDUCTOR3000 was the first pilot production facility for 300nm wafers in the world. This company, a joint venture between Infineon Technologies and Motorola, is working to develop a manufacturable 300mm wafer tool set. The lithography tools incl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f9a47d771afa9050efb8af53d4e835a2
https://doi.org/10.1117/12.389080
https://doi.org/10.1117/12.389080
Autor:
Steffen Hornig, Alain Charles, Thomas Metzdorf, Wolfram Koestler, Guenther Hraschan, Ralf Otto, Sebastian Schmidt, John Maltabes, Dietmar Ganz, Thorsten Schedel, Ralf Schuster, Karl Mautz
Publikováno v:
SPIE Proceedings.
SEMICONDUCTOR300 was the first pilot production facility for 300mm wafers in the world. This company, a joint venture between Infineon Technologies and Motorola, is working to develop a manufacturable 300mm wafer tool set. The lithography tools inclu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::997d833292500beba596f6be1384697e
https://doi.org/10.1117/12.389023
https://doi.org/10.1117/12.389023
Autor:
Steffen Hornig, Ralf Otto, Guenther Hraschan, Alain Charles, Sebastian Schmidt, Leroy Grant, Karl Mautz, John Maltabes, Dietmar Ganz, Thorsten Schedel
Publikováno v:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing V.
SEMICONDUCTOR300 (SC300) is the first pilot manufacturing facility for 300 mm wafers in the world. This company, a joint venture between Infineon Technologies and Motorola, is working on developing a 300 mm manufacturing tool set. The pilot line cont
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::37b63ab2f63849ed4c474bdc00d0c7b9
https://doi.org/10.1117/12.361302
https://doi.org/10.1117/12.361302
Autor:
Alain Charles, Sebastian Schmidt, Steffen Hornig, Dietmar Ganz, Thorsten Schedel, John Maltabes
Publikováno v:
SPIE Proceedings.
Semiconductor 300 is the first pilot manufacturing facility for 300mm wafers in the world. This company is a joint venture between Siemens and Motorola, formed for the purpose of developing a 300mm manufacturing tool set. The pilot line contains a fu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::205bdae8b8609a9842e0e027916f5f77
https://doi.org/10.1117/12.354360
https://doi.org/10.1117/12.354360