Výsledky vyhledávání - "Dierdre Hale"

Package Technology Selection of 28nm High Power FPGA with Pb-Free Solder Bumps: Flip Chip Molded BGA (FCMBGA) versus Traditional Flip Chip Bare Die Package

Autor: Joon Dong Kim, Michael Lyakas, Dierdre Hale, Altaf Hasan, Corey Reichman, Miguel Jimarez, Romina Mimi Ocampo, Aaron Elberg, Fred Hamilton

Publikováno v: International Symposium on Microelectronics. 2013:000239-000244

Selecting the optimal flip-chip package technology for the next generation 28nm FPGA is critical not only to meet reliability benchmarks for Pb-free bumps, but also in meeting the field-use environment requirements for high power devices. Component l

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::8ccd413328c27121bbb6264dd51a22bf
https://doi.org/10.4071/isom-2013-tp22

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