Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Diego Reinoso Cocina"'
Autor:
Michael Merschky, Fabian Michalik, Robin Taylor, Martin Thoms, Diego Reinoso-Cocina, Patrick Brooks, Stephan Hotz
Publikováno v:
International Symposium on Microelectronics. 2017:000458-000463
With the trends towards miniaturization and heterogeneous integration, both IC and advanced substrate manufacturers are striving to meet the needs of next generation platforms, to increase the density of interconnects, and generate conductors featuri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1bc996f01929287bda3d3188539a2740
https://doi.org/10.4071/isom-2017-wp51_084
https://doi.org/10.4071/isom-2017-wp51_084
Autor:
Min Fee Tai, Swee Leong Kok, Kenichiroh Mukai, Patrick Brooks, Diego Reinoso Cocina, Stephan Hotz
Publikováno v:
Advances in Science, Technology and Engineering Systems, Vol 2, Iss 3, Pp 1159-1164 (2017)
Conformal metalization on mold compound offers new possibility for IC package design to improve features such as rigidization of the flexible core, heat sink capability, 3D-circuit patterning and the electromagnetic interference (EMI) shielding. With
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d01f0924b85f045203b9b5337ec1f09b
https://astesj.com/v02/i03/p146/
https://astesj.com/v02/i03/p146/