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pro vyhledávání: '"Diego Pincini"'
Publikováno v:
RWS
A layout based finite element thermal convection model including detailed board tracing and packaging information is developed. A state-of-art 0.13-µm SiGe BiCMOS chip with embedded poly-resistors and thermal diodes are used as experimental validati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36947814b5eb131fca97a38bc21cc625
https://doi.org/10.1109/rws45077.2020.9050057
https://doi.org/10.1109/rws45077.2020.9050057
