Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Didier Campos"'
Autor:
Didier Campos, P. Coudrain, Yorrick Exbrayat, Lucile Arnaud, Stephane Minoret, F. Ponthenier, Andrea Vinci, Severine Cheramy, Alain Gueugnot, Daniel Scevola, Cesar Fuguet Tortolero, P. Chausse, Roselyne Segaud, Giovanni Romano, Christophe Aumont, Didier Lattard, Jean Charbonnier, Pierre-Emile Philip, C. Ribiere, Arnaud Garnier, Jean Michailos, Mathilde Gottardi, Raphael Eleouet, Frédéric Berger, Eric Guthmuller, Gilles Simon, Jerome Beltritti, Gilles Romero, Maxime Argoud, Denis Dutoit, Alexis Farcy, Nacima Allouti, Therry Mourier, Remi Velard, Pascal Vivet, Corinne Legalland
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
We report the first successful technology integration of chiplets on an active silicon interposer, fully processed, packaged and tested. Benefits of chiplet-based architectures are discussed. Built up technology is presented and focused on 3D interco
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d8afe955b96b263c988971d8f1f91372
https://doi.org/10.1109/ectc.2019.00092
https://doi.org/10.1109/ectc.2019.00092
Autor:
O. Le-Briz, R. Franiatte, R. Prieto, Perceval Coudrain, C. Brunet-Manquat, Jean-Philippe Colonna, Y. Hallez, C. Chancel, V. Rat, Didier Campos
Publikováno v:
2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Thermal dissipation is a major concern in microelectronics, especially for compact packages and 3D circuits where the dense stacking of thin silicon layers leads to a significant increase of heat densities. Direct hybrid bonding is considered as one
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0335869bfd657d3bde92bd42032b318c
https://doi.org/10.1109/therminic.2017.8233830
https://doi.org/10.1109/therminic.2017.8233830