Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Dick J. Chang"'
Publikováno v:
Thin Solid Films. 223:253-259
Thermal and residual stresses in films exposed to sudden temperature changes are analyzed based on an elastoplastic-brittle idealization of film response. The results thus obtained are used to explain qualitatively the damage mechanisms of various fa
Publikováno v:
Journal of Materials Research. 7:2798-2809
It now appears generally accepted that the process of stress-induced orientation and graphitization of a thermoset-resin-derived matrix in a carbon-fiber/carbon-matrix (C/C) composite is principally a result of molecular orientation induced during th
Publikováno v:
47th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics, and Materials Conference 14th AIAA/ASME/AHS Adaptive Structures Conference 7th.
An analytical model to predict the bypass and bearing strength of composites is developed. The model includes a contact algorithm, finite deformation theory, nonlinear material behavior, and the progressive damage of composites. The orientation and d
Publikováno v:
SPIE Proceedings.
Raman spectroscopy is used as a non-contact probe of stress with high spatial resolution in micro-machined silicon structures. The motivation for this work is that reliability or cycle life can be substantially increased by understanding the origin o
Publikováno v:
SPIE Proceedings.
Raman spectroscopy is used as a non-contact method in measuring stresses at the surface of a crystalline structure or the crystalline-coated surface of an amorphous structure. The stress measurement capability is based on the relative frequency shift
Autor:
Dick J. Chang, Rokuro Muki
Publikováno v:
International Journal of Solids and Structures. 10:503-517
This paper deals with the elastostatic load transfer of a tensile load in a model of an adhesive lap joint (tension-shear problem). The adhesive layer is regarded as infinitesimally thin and the displacement and traction vectors in the adherends are
Publikováno v:
Thin Solid Films. 150:258-267
Thermal deflection of a cantilever substrate and a circular wafer during and after film deposition is analyzed. Simple and accurate expressions for the substrate temperature are obtained under the assumption of a constant heat flux at the front surfa
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