Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Diaofeng Li"'
Autor:
Solomon Kerealme Yeshanew, Chunguang Bai, Qing Jia, Tong Xi, Zhiqiang Zhang, Diaofeng Li, Zhizhou Xia, Rui Yang, Ke Yang
Publikováno v:
Journal of Materials Research and Technology, Vol 30, Iss , Pp 7545-7562 (2024)
In order to investigate the influence of gradual stress relieving treatment on the microstructure, texture evolution, grain structure, and misorientation distribution of the hot-rolled Ti6Al4V–5Cu (α+β) alloy deformed in various thickness reducti
Externí odkaz:
https://doaj.org/article/c564838dc8774115bf63ff6a27ae5349
Autor:
Solomon Kerealme Yeshanew, Chunguang Bai, Qing Jia, Tong Xi, Zhiqiang Zhang, Diaofeng Li, Zhizhou Xia, Rui Yang, Ke Yang
Publikováno v:
Materials, Vol 15, Iss 9, p 3349 (2022)
The hot workability behavior of antibacterial Ti6Al4V-5Cu alloy was investigated using a hot compression experiment in the temperature range of 790–1040 °C and strain rate of 10−3–10 s−1 with a strain of 0.4. The deformation behavior of the
Externí odkaz:
https://doaj.org/article/15c2584ec1a74a4287bb9a69d6b3852c
Autor:
Solomon Kerealme Yeshanew, Chunguang Bai, Qing Jia, Tong Xi, Zhiqiang Zhang, Diaofeng Li, Zhizhou Xia, Rui Yang, Ke Yang
Publikováno v:
Acta Metallurgica Sinica (English Letters).
Autor:
Solomon Kerealme Yeshanew, Chunguang Bai, Qing Jia, Tong Xi, Zhiqiang Zhang, Diaofeng Li, Zhizhou Xia, Rui Yang, Ke Yang
Publikováno v:
Materials Chemistry and Physics. 298:127478
Autor:
Solomon Kerealme, Chunguang Bai, Qing Jia, Tong Xi, Zhiqiang Zhang, Diaofeng Li, Zhizhou Xia, Rui Yang, Ke Yang
Publikováno v:
Materials Today Communications. 33:104508
Publikováno v:
Journal of Alloys and Compounds. 906:164335
Publikováno v:
Materials & Design, Vol 90, Iss, Pp 820-828 (2016)
In this paper, an efficient route that combined addition of excessive Mg (3.6 wt.%) and a trace of La (0.5 wt.%) as well as subsequent T6 heat treatment has been first proposed to modify the detrimental platelet-like β-Al5FeSi Fe-rich intermetallic
Publikováno v:
Materials & Design. Jan2016, Vol. 90, p820-828. 9p.