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Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
This paper presents an analysis on panel warpage as the growth of the panel exceeds beyond current wafer sizes. This work is a part of iNemi working group "Wafer/Panel Level Package Flowability and Warpage Project". The aim of the project is to under
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1431aeaa49a00d7c086007e04d0516c9
https://doi.org/10.1109/estc48849.2020.9229746
https://doi.org/10.1109/estc48849.2020.9229746
