Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Diana Shaphirov"'
Publikováno v:
Metrology, Inspection, and Process Control XXXVII.
Autor:
Xiaolei Liu, Yoav Grauer, Raviv Yohanan, Mark Ghinovker, Diana Shaphirov, Yasuhisa Iwata, Koichi Imura, Kosuke Ito
Publikováno v:
Metrology, Inspection, and Process Control XXXVI.
Autor:
Nahee Park, Dohwa Lee, Liu Liu, Xuefei Zhou, Hongpeng Su, DongSub Choi, Wayne Zhou, Hedvi Spielberg, Efi Megged, Chen Dror, Diana Shaphirov, Zephyr Liu, Mark Ghinovker, DongYoung Lee, Hongbok Yeon, Hyunjun Kim, Sukwon Park, Bohye Kim, Honggoo Lee, Sangho Lee
Publikováno v:
Metrology, Inspection, and Process Control XXXVI.
Autor:
Katya Gordon, Hedvi Spielberg, Diana Shaphirov, Xiaolei Liu, Eltsafon Ashwal, Eitan Hajaj, Philippe Leray, Mark Ghinovker, Chen Dror, Raviv Yohanan, Zephyr Liu, Dieter Van den Heuvel, Roel Gronheid
Publikováno v:
Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV.
As design nodes of advanced semiconductor chips shrink, reduction in on-product overlay (OPO) budget becomes more critical to achieving higher yield. Imaging-based overlay (IBO) targets usually consist of periodic patterns where their pitches are res
Autor:
Mark Ghinovker, Katya Gordon, Eltsafon Ashwal, Eitan Hajaj, Isaac Salib, Raviv Yohanan, Xiaolei Liu, Chen Dror, Zephyr Liu, Diana Shaphirov
Publikováno v:
Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV.
In recent years, simulation-based analysis has become an integral phase in metrology targets design process, performances optimization wise to support on product overlay (OPO) reduction, accuracy and robustness to process variation. Moreover, a simul
Autor:
Chanha Park, Xiaolei Liu, Dongyoung Lee, Chen Dror, Eltsafon Ashwal, Dongsoo Kim, Sanghuck Jeon, Zephyr Liu, Katya Gordon, Honggoo Lee, Eitan Hajaj, Mark Ghinovker, Diana Shaphirov, Sang-Ho Lee, Dongsub Choi, Dohwa Lee, Raviv Yohanan
Publikováno v:
Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV.
Reduction in on product overlay (OPO) is a key component for high-end, high yield integrated circuit manufacturing. Due to the continually shrinking dimensions of the IC device elements it has become near-impossible to measure overlay on the device i