Zobrazeno 1 - 10
of 36
pro vyhledávání: '"Diana E. Hun"'
Autor:
Som S. Shrestha, Janak Tiwari, Amit Rai, Diana E. Hun, Daniel Howard, Andre O. Desjarlais, Mathieu Francoeur, Tianli Feng
Publikováno v:
International Journal of Thermal Sciences. 187:108164
Autor:
Hongyu Zhou, Amit Rai, Tianli Feng, Som S Shrestha, Mingkan Zhang, Diana E. Hun, Daniel Howard
Publikováno v:
Computational Thermal Sciences: An International Journal. 13:19-32
Publikováno v:
RSC Advances. 10:31065-31069
Hydrophobic hollow silica particles are desirable for several applications such as hydrophobic coatings, thermal insulation, and thermally resistant insulative paints. However, converting hydrophilic particles into hydrophobic particles without compr
Autor:
Som Shrestha, Janak Tiwari, Amit Rai, Diana E. Hun, Daniel Howard, Andre O. Desjarlais, Mathieu Francoeur, Tianli Feng
Publikováno v:
SSRN Electronic Journal.
Autor:
Jesse Heineman, Joshua E. Vaughan, Brian K. Post, Phillip C. Chesser, Peter L. Wang, Alex Roschli, Celeste Atkins, Melissa Voss Lapsa, Diana E. Hun, Emma Betters, Amy Loy, Alex M. Boulger
Publikováno v:
Volume 2A: Advanced Manufacturing.
Construction is filled with labor intensive, hazardous, and often wasteful processes. It is also an enormous industry, so improvements in efficiency could have a tremendous economic impact. Construction-scale additive manufacturing is one path toward
Publikováno v:
Physical Review Applied. 14
Manipulating thermal conductivity through nanoengineering is of critical importance to advance technologies, such as soft robotics, artificial skin, wearable electronics, batteries, thermal insulation, and thermoelectrics. Here, by examining amorphou
Autor:
Hsin Wang, Kai Li, Soydan Ozcan, Tej N. Lamichhane, Wei Guo, Edgar Lara-Curzio, Shannon M. Mahurin, Meghan E. Lamm, Gabriel M. Veith, Diana E. Hun, Annie Stevens, Tolga Aytug, Kaushik Biswas
Publikováno v:
Vacuum. 195:110667
Thermal insulation materials are crucial to improve the energy performance of buildings and industrial applications. We report an approach to create hermetically vacuum-sealed silica-based hollow microspheres that can lower the thermal conductivity o
Publikováno v:
Energies
Volume 12
Issue 19
Pages: 3783
Energies, Vol 12, Iss 19, p 3783 (2019)
Volume 12
Issue 19
Pages: 3783
Energies, Vol 12, Iss 19, p 3783 (2019)
This article describes a novel application of thermal anisotropy for improving the energy efficiency of building envelopes. The current work was inspired by existing research on improved heat dissipation in electronics using thermal anisotropy. Past