Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Dhananjay Panchagade"'
Publikováno v:
International Journal of Engineering Trends and Technology. 39:160-167
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8ff5995e08fd4a573dc08b24dcb90a0
https://doi.org/10.14445/22315381/ijett-v39p228
https://doi.org/10.14445/22315381/ijett-v39p228
Publikováno v:
Progress in Photovoltaics: Research and Applications. 23:570-581
Photovoltaic devices are often sensitive to moisture and must be packaged in such a way as to limit moisture ingress for 25 years or more. Typically, this is accomplished through the use of impermeable front and backsheets (e.g., glass sheets or meta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e57f544989f37cf89b5f789a2543ccc
https://doi.org/10.1002/pip.2465
https://doi.org/10.1002/pip.2465
Publikováno v:
IEEE Journal of Photovoltaics. 1:242-247
@font-face {font-family: "Arial";}p.MsoNormal, li.MsoNormal, div. MsoNormal {margin: 0in 0in 0.0001pt; font-size: 12pt; font-family: "Times New Roman";}div. Section1 {page: Section1;} A finite element model has been created to quantify the thermal fa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c63ebe239c8bc884590f4533cc2cd751
https://doi.org/10.1109/jphotov.2011.2172575
https://doi.org/10.1109/jphotov.2011.2172575
Autor:
James Hofmeister, Pradeep Lall, Prashant Gupta, J. Suhling, Dhananjay Panchagade, Mandar Kulkarni
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 33:289-302
In this paper, autoregressive and time-frequency-based techniques have been investigated to predict and monitor the damage in implantable biological electronics such as pacemakers and defibrillators. The approach focuses is on the pre-failure space a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1657bc767d88b1e4d7829932fce05465
https://doi.org/10.1109/tepm.2010.2078824
https://doi.org/10.1109/tepm.2010.2078824
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 32:311-324
In this paper, a design-envelope approach based on optical feature extraction techniques has been investigated for drop and shock survivability of electronic packaging has been presented for 6-leadfree solder alloy systems. Solder alloy systems inves
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::61c6655d07cd6c865248db1f4ca7ed0d
https://doi.org/10.1109/tepm.2009.2031873
https://doi.org/10.1109/tepm.2009.2031873
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 32:378-395
Electronics may be subjected to shock, vibration, and drop-impact during shipping, handling and during normal usage. Measurement of transient dynamic deformation of the electronics assemblies during the shock and vibration can yield significant insig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a55f622817b5294aa02e0376c1fe9cd1
https://doi.org/10.1109/tcapt.2009.2020915
https://doi.org/10.1109/tcapt.2009.2020915
Publikováno v:
Journal of Electronic Packaging. 129:373-381
Portable electronics is subjected to extreme accelerations in shock and drop impact. Product development cycle times and the cost constraints often restrict the number of design variations tested for drop robustness prior to identification of the fin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9df4ff306fae1502dfbe9e1bd5c7d4fe
https://doi.org/10.1115/1.2804085
https://doi.org/10.1115/1.2804085
Peridynamic-models using finite elements for shock and vibration reliability of leadfree electronics
Publikováno v:
2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
Electronic packages subjected to drop and shock have been simulated using alternative theory known as peridynamic theory in the realm of FEM. In peridynamics, problems are formulated in terms of integral equation which is a substitute to conventional
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::894c8f6994ca635c30a3f6dc7b5d3c80
https://doi.org/10.1109/itherm.2010.5501274
https://doi.org/10.1109/itherm.2010.5501274
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Models for crack initiation and propagation in leadfree solders under shock-impact events have been developed using extended finite element method (XFEM). XFEM enables the modeling the solder interconnect without explicitly meshing the crack surface.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::227cb078cd5d9e4c0cff1466e6b13fab
https://doi.org/10.1109/ectc.2010.5490891
https://doi.org/10.1109/ectc.2010.5490891
Publikováno v:
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
Portable electronic products subjected to transient shock may exhibit multiple failure modes in vicinity of the interconnects. Failure is often diagnosed by loss of functionality using techniques including the built-in self test, which provides limit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9dc1bc729311eebcc6d0e63ad8cc7eec
https://doi.org/10.1109/ectc.2010.5490853
https://doi.org/10.1109/ectc.2010.5490853