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pro vyhledávání: '"Detlef Pabst"'
Publikováno v:
IEEE Transactions on Automation Science and Engineering. 17:475-489
Machines need to be individually qualified to run lots of certain families in semiconductor wafer fabrication facilities (wafer fabs). A qualification time window that lasts a couple of days is associated with each family and each tool. The time wind
Autor:
Gottfried Nieke, Karlheinz Bock, Marcel Stehli, Detlef Pabst, Christian Maleck, Meinhard Schulze
Publikováno v:
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
In this paper we will present a multi-stage scheduling approach to generate robust schedules for a challenging aspect of semiconductor manufacturing called time-link areas. A time-link is a technologically induced time constraint between one or more
Publikováno v:
2018 Winter Simulation Conference (WSC).
Publikováno v:
CASE
In this paper, we discuss requalification strategies for stepper tools in semiconductor wafer fabrication facilities (wafer fabs). Before processing lots on steppers, the steppers have to be qualified. A mathematical programming formulation is used p
Publikováno v:
2016 Winter Simulation Conference (WSC).
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 23:168-177
The exponentially weighted moving average (EWMA) filter is commonly used for state estimation of run-to-run controllers in semiconductor manufacturing. It is widely known that, when at steady state, the EWMA filter provides the minimum mean square er
Publikováno v:
2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
Chaos theory has been a young research field with successful applications to a variety of areas. Even though former publications have assessed the question if production systems behave chaotic, little work has been published on real life production s
Publikováno v:
ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference.
Diffusion processes in semiconductor fabrication facilities (Fabs) usually refer to the series of processes from wafer cleaning processes to furnace processes. Most furnace tools are batch tools with large batch sizes and have relatively long process