Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Deschaseaux Edouard"'
Autor:
Thomas, Candice, Michel, Jean-Philippe, Deschaseaux, Edouard, Charbonnier, Jean, Souil, Richard, Vermande, Elisa, Campo, Alain, Farjot, Thierry, Rodriguez, Guillaume, Romano, Giovanni, Gustavo, Frédéric, Jadot, Baptiste, Thiney, Vivien, Thonnart, Yvain, Billiot, Gérard, Meunier, Tristan, Vinet, Maud
Publikováno v:
Mater. Quantum. Technol. 2 035001, (2022)
To reach large-scale quantum computing, three-dimensional integration of scalable qubit arrays and their control electronics in multi-chip assemblies is promising. Within these assemblies, the use of superconducting interconnections, as routing layer
Externí odkaz:
http://arxiv.org/abs/2206.09727
Autor:
Le Tulzo, Harold, Celeste, Loriana, Tendero, Inès, Derakhshandeh, Jaber, Gerets, Carine, Thomas, Candice, Charbonnier, Jean, Deschaseaux, Edouard, Lazerand, Thierry, Daviot, Jérôme
Publikováno v:
In Microelectronic Engineering 1 May 2023 276
Autor:
Feautrier, Céline, Deschaseaux, Edouard, Gueugnot, Alain, Charbonnier, Jean, Plihon, Aurélia, Dupré, Ludovic, Henry, Franck, Berger, Frédéric, Pagot, Antoine, Renet, Sébastien, Mailliart, Olivier, Thomas, Candice
Publikováno v:
ECTC
ECTC, May 2023, Orlando, United States. pp.973-979, ⟨10.1109/ECTC51909.2023.00166⟩
ECTC, May 2023, Orlando, United States. pp.973-979, ⟨10.1109/ECTC51909.2023.00166⟩
International audience; Large-scale integration of quantum bits and quantum technologies relies on multi-chip assemblies. In that context, we focus on indium microbumps to connect chips made from different materials and technological nodes. We have f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______3515::a724e84019a77ff3e54bb7645f70de23
https://cea.hal.science/cea-04139267
https://cea.hal.science/cea-04139267
Autor:
Giry Alexandre, Gabriel Pares, Michel Jean-Philippe, Ferris Pierre, Serhan Ayssar, Deschaseaux Edouard
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Silicon interposers are providing interesting alternatives to organic packages for the fabrication of complex system in package (SIP) modules in particular for RF application. Among the advantages of this technology are the capability to fabricate fi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a7cf37c5de5bc21aa7719098dd9b039
https://doi.org/10.1109/ectc.2019.00198
https://doi.org/10.1109/ectc.2019.00198
Akademický článek
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Autor:
Charbonnier, Jean, Assous, Myriam, Bally, Jean-Philippe, Deschaseaux, Edouard, Ratin, Christophe, Hida, Rachid, Poulain, Christophe, Allouti, Nacima, Issele, Helene, Vignoud, Lionel, Moreau, Stephane, Simon, Gilles
Publikováno v:
2013 European Microelectronics Packaging Conference (EMPC); 2013, p1-4, 4p