Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Deok-Gon Han"'
Publikováno v:
Materials, Vol 17, Iss 14, p 3619 (2024)
In this study, we investigated the brittle fracture behavior of Sn-3.0Ag-0.5Cu (SAC305) solder joints with a Direct Electroless Gold (DEG) surface finish, formed using laser-assisted bonding (LAB) and mass reflow (MR) techniques. Commercial SAC305 so
Externí odkaz:
https://doaj.org/article/68d99af805e447c19c87cf27aaf721f7
Publikováno v:
Materials, Vol 16, Iss 4, p 1739 (2023)
Thermo-compression bonding (TCB) properties of Cu/SnAg pillar bumps on electroless palladium immersion gold (EPIG) were evaluated in this study. A test chip with Cu/SnAg pillar bumps was bonded on the surface-finished Cu pads with the TCB method. The
Externí odkaz:
https://doaj.org/article/443b55c5a35b4ab592144b1f8d07c633
Publikováno v:
Journal of Materials Science: Materials in Electronics. 34
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::70a16b059ff90f75087bff3f9dc22b82
https://doi.org/10.1007/s10854-022-09510-0
https://doi.org/10.1007/s10854-022-09510-0
Publikováno v:
Journal of the Microelectronics and Packaging Society. 24:83-90
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ecd8f031fc0630c89b4e6be9ea15e52e
https://doi.org/10.6117/kmeps.2017.24.1.083
https://doi.org/10.6117/kmeps.2017.24.1.083
Publikováno v:
2012 14th International Conference on Electronic Materials and Packaging (EMAP).
Brittle fracture generally occurred when a high level of strain and strain rate is applied. Since the brittle fracture takes place in the layer of intermetallic compound(IMC), the controlling of the IMC layer is important to lower the occurrence of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a7e28e6ad5b8fbc210bb83766abb970
https://doi.org/10.1109/emap.2012.6507909
https://doi.org/10.1109/emap.2012.6507909
Autor:
Tae-Ho Lee, Sehoon Yoo, Chang-Woo Lee, Deok-Gon Han, Kang-Dong Kim, Sang-Hyun Kwon, Tae-Hyun Sung
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
Brittle fracture behavior of Sn-Ag-Cu solders on ENIG and ENEPIG surface finish were evaluated with varying the metal turn over (MTO) of the Ni(P) plating solution in this study. As the MTO increased, the shear strength of the solder joints decreased
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ee89dc675f7aa4f1826c5e1b9723175
https://doi.org/10.1109/eptc.2012.6507079
https://doi.org/10.1109/eptc.2012.6507079
Publikováno v:
2012 14th International Conference on Electronic Materials & Packaging (EMAP); 2012, p1-3, 3p