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pro vyhledávání: '"Dennis R. Conti"'
Autor:
Mary P. Kusko, Edward Michael Seymour, B. Walsh, Orazio P. Forlenza, Donato O. Forlenza, Timothy D. Taylor, James M. Crafts, Dennis R. Conti, William V. Huott, David C. Bogdan
Publikováno v:
ITC
The IBM Power 7™ 4 GHz, eight core microprocessor introduced several new challenges for the Power 7 test team: new pervasive test architecture, 8 asynchronous processor cores, DRAM integrated on the same die as processor and enhanced thermal test r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dbf65da51ebe36eee4060cf2febb9171
https://doi.org/10.1109/test.2010.5699204
https://doi.org/10.1109/test.2010.5699204
Autor:
Dennis R. Conti
Publikováno v:
ITC
Summary form only given. A premise behind the open architecture system is to have a single set of hardware and software standards across the test industry, allowing instrumentation to be exchanged between ATE supplier boundaries. This paper asks whet
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49ca79148bc6942c0d1402ffd3b0bf85
https://doi.org/10.1109/test.2002.1041912
https://doi.org/10.1109/test.2002.1041912
Autor:
Dennis R. Conti, J. Van Horn
Publikováno v:
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
Is it the industry's intent to apply wafer-level burn-in (WLBI) to MPUs and ASICs? Package-level burn-in (PLBI) today is facing escalating burn-in power dissipation for these MPU and ASIC devices. The burn-in board (BIB) density (devices/BIB) varies
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ded805fe004ba958a6d049d9286d5b6
https://doi.org/10.1109/ectc.2000.853255
https://doi.org/10.1109/ectc.2000.853255
Conference
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