Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Dennis Prem Kumar Chandran"'
Publikováno v:
2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
Summary form only given. Materials used in the electronic packaging industry are generally categorizes as Direct and Indirect materials. Direct materials would constitute items like substrates, underfill, thermal lids, fluxes, solder materials. On th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bc997e67904044234dbe8e53a057ae56
https://doi.org/10.1109/iemt.2012.6521779
https://doi.org/10.1109/iemt.2012.6521779
Autor:
Dennis Prem Kumar Chandran, null Sow, null Yeek Kooi, null Mohd Hasri Mohd Harizan, Chee Choong Kooi, null Teoh Teik Hoy, null Chong Kim Foong
Publikováno v:
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).
The Intel Malaysia Electronic Packaging Higher Education Program Team is proudly one of the teams to benchmark among the industry for their engagement with Malaysian universities. This team was formed with the objective of collaborating with Malaysia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e56e81000b55554588354a578c49319f
https://doi.org/10.1109/iemt.2010.5746684
https://doi.org/10.1109/iemt.2010.5746684
Autor:
Chin Hock Toh, Thomas J. Fitzgerald, Madhuri R. Narkhede, Alfred A. La Mar, Arun Raman, Dennis Prem Kumar Chandran
Publikováno v:
ASME 2007 InterPACK Conference, Volume 2.
This paper summarizes the intermetallic compounds (IMC) formation at the interface between thermal interface material (TIM) and nickel/gold plated integrated heat spreader (IHS) at varying Au thickness, and its impact on thermal reliability. Indium s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3241af21fe3bd9f8307e7de43daf175b
https://doi.org/10.1115/ipack2007-33505
https://doi.org/10.1115/ipack2007-33505
Publikováno v:
2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1.
This paper concentrates on the characterization of a novel curable fillet forming ball attach flux. This polymer based material is expected to improve 2nd level interconnet solder joint reliability on ball grid array packages. The evaluations reporte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::29eb4ca7343ddeaf93a22e5edb80b0f0
https://doi.org/10.1115/ipack2003-35038
https://doi.org/10.1115/ipack2003-35038