Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Dennis G. Manzer"'
Autor:
B. C. Webb, Steven L. Wright, P.S. Andry, Dennis G. Manzer, Edmund J. Sprogis, B. Dang, Cornelia K. Tsang
Publikováno v:
IBM Journal of Research and Development. 52:571-581
As traditional CMOS scaling becomes progressively more difficult and less beneficial to overall system performance, three-dimensional silicon integration technologies have begun to receive considerable attention. An advanced packaging solution based
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3978384ff5967391acbf7d566d1b2d8e
https://doi.org/10.1147/jrd.2008.5388558
https://doi.org/10.1147/jrd.2008.5388558
Autor:
Chirag S. Patel, Edmund J. Sprogis, Cornelia K. Tsang, P.S. Andry, B. C. Webb, R. Horton, Robert J. Polastre, Steven L. Wright, Leena Paivikki Buchwalter, Dennis G. Manzer, John U. Knickerbocker
Publikováno v:
56th Electronic Components and Technology Conference 2006.
In the past, traditional CMOS scaling has been one of the principal levers to achieve increased system-level performance. Today, scaling is becoming increasingly difficult and less effective, and a range of new two- and three-dimensional silicon inte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a062c0ee006a12099abc353046562680
https://doi.org/10.1109/ectc.2006.1645754
https://doi.org/10.1109/ectc.2006.1645754
Autor:
B. C. Webb, John H. Magerlein, Hua Gan, E.S. Sprogis, Robert J. Polastre, Sri M. Sri-Jayantha, Chirag S. Patel, Steven L. Wright, P.S. Andry, John U. Knickerbocker, Dennis G. Manzer, R. Horton, Evan G. Colgan, John M. Cotte, Cornelia K. Tsang, Leena Paivikki Buchwalter, Gerard McVicker
Publikováno v:
56th Electronic Components and Technology Conference 2006.
A silicon-based system-on-package (SOP) is described. Novel capabilities of SOP are expected to enable lower cost, more efficient and higher performance electronic systems. Newly developed technology elements include: electrical silicon through-vias,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9334f91c4f59ba2e6c20aabba8e7128
https://doi.org/10.1109/ectc.2006.1645680
https://doi.org/10.1109/ectc.2006.1645680
Autor:
Paul S. Andry, Bucknell C. Webb, Cornelia K. Tsang, Edmund J. Sprogis, Chirag S. Patel, John U. Knickerbocker, Dennis G. Manzer
Publikováno v:
MRS Proceedings. 970
As the limits of traditional CMOS scaling are approached, process integration has become increasingly difficult and resulting in a diminished rate of performance improvement over time. Consequently, the search for new two- and three- dimensional sub-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::583dc84adf800ba019bc1b3c6de58244
https://doi.org/10.1557/proc-0970-y01-01
https://doi.org/10.1557/proc-0970-y01-01
Autor:
Steve Wilson, A. Pelella, Dennis G. Manzer, Moyra K. McManus, Pia Naoko Sanda, Daniel R. Knebel, William V. Huott, Steven E. Steen, Stas Polonsky, Yuen Chan
Publikováno v:
ITC
This paper will provide a case study of a particularly difficult debug problem (the Holey Shmoo problem) which developed while designing the IBM System/390 G6 637 MHz microprocessor chip. Resolution of this problem involved the use of some of today's
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::987e4368084dbeb5be7751285d40885a
https://doi.org/10.1109/test.1999.805820
https://doi.org/10.1109/test.1999.805820
Autor:
Steve Wilson, Dennis G. Manzer, Yuen Chan, Moyra K. McManus, Antonio R. Pelella, Daniel R. Knebel, William V. Huott, Steven E. Steen, Pia Naoko Sanda, Stas Polonsky
Publikováno v:
2000 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.00CH37056).
Picosecond imaging circuit analysis (PICA) is recently demonstrated to be a practical measurement technique of internal timing of ICs. This paper describes application of PICA to analysis of individual MOSFET switching times in the L1 cache write con
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e316ef0e09d72259594cdbbbd0d9decf
https://doi.org/10.1109/isscc.2000.839758
https://doi.org/10.1109/isscc.2000.839758
Publikováno v:
High-Speed Imaging and Sequence Analysis III.
IBM Research has developed a time resolved imaging technique, Picosecond Imaging Circuit Analysis (PICA), which uses single photon events to analyze signals in modern microprocessors on a picosecond time scale. This paper will describe the experiment
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6bc4d72adf57c3b27d213c5d80f79934
https://doi.org/10.1117/12.424998
https://doi.org/10.1117/12.424998
Autor:
Dennis G. Manzer, Dan Knebel, Steven E. Steen, Yuen Chan, Steve Wilson, Tony Pelella, B. Huott, Pia Naoko Sanda, Stas Polonsky, Moyra K. McManus
Publikováno v:
International Symposium for Testing and Failure Analysis.
Picosecond Imaging Circuit Analysis (PICA) is a new technique shown here to be applicable to the analysis of complex VLSI circuits. PICA was used to diagnose a timing failure in the early design of the G6 microprocessor chip. The fault occurred at hi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f5a07c29e3b37a61b2203c76a603fd7
https://doi.org/10.31399/asm.cp.istfa1999p0035
https://doi.org/10.31399/asm.cp.istfa1999p0035
Publikováno v:
Hard Copy Output.
One of the challenges of 960 dot-per-inch resistive ribbon thermal transfer - R2T2 - printing is the control of energy delivered to the print head to assure very high fidelity printing. A method of manipulating image data to combat the undesired effe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e67ca57009c7fa3fe81432f3d49b0ee
https://doi.org/10.1117/12.952827
https://doi.org/10.1117/12.952827
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