Zobrazeno 1 - 2
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pro vyhledávání: '"Dennis C.P. Leung"'
Publikováno v:
2019 Electrical Design of Advanced Packaging and Systems (EDAPS).
As the silicon technology shrinking transistors to deep nanometer, the IO speed and logic density drive up the package design complexity drastically. The design performance validation is no longer scalable by resorting to traditional electrical model
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::61eed4d05fa48fc6e4185b0489addd0c
https://doi.org/10.1109/edaps47854.2019.9011678
https://doi.org/10.1109/edaps47854.2019.9011678
Autor:
Guna S Selvaduray, Dennis C.P. Leung
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 5:104-115
Microvia failures in flip chip ball grid array (FCBGA) polymeric substrates have been a major concern in the development of reliable packages for high-performance and high-density chips. To determine the relationship between reliability and design fa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13fede0402846da94e692bd05a2236b2
https://doi.org/10.4071/1551-4897-5.3.104
https://doi.org/10.4071/1551-4897-5.3.104