Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Denis Fros"'
Publikováno v:
IEEE Open Journal of Nanotechnology, Vol 3, Pp 182-190 (2022)
Biodegradables are a promising path for the future of electronics in a greener mindset. The review study focuses on their applications and past and current research results. The paper also investigates the application of nanomaterials as fillers to c
Externí odkaz:
https://doaj.org/article/90b40d9f911d4e7d9c559160022d4d17
Autor:
Denis Fros, Petr Vesely
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c1474b178ca0797bf710531d40ce6328
https://doi.org/10.1109/isse54558.2022.9812709
https://doi.org/10.1109/isse54558.2022.9812709
Autor:
Karel Dusek, Petr Vesely, Denis Fros, Martin Kozak, Kristina Sorokina, Zbynek Plachy, David Busek, Jaroslav Dusek, Iva Kralova, Marketa Klimtova, Martin Placek
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5ffbab2085faeb18f751299731282482
https://doi.org/10.1109/isse54558.2022.9812772
https://doi.org/10.1109/isse54558.2022.9812772
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c9a663b3df5b6eed3b027c8b83071a32
https://doi.org/10.1109/isse54558.2022.9812811
https://doi.org/10.1109/isse54558.2022.9812811
Autor:
Denis Fros, Petr Vesely
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
This work aimed to evaluate the change of properties of joints based on bismuth-tin eutectic alloy soldered under various reflow conditions during long-term accelerated aging tests. Four temperature profiles were used for the reflow soldering of test
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97279bb5b9149a667c5701093d663917
https://doi.org/10.1109/isse51996.2021.9467630
https://doi.org/10.1109/isse51996.2021.9467630
Autor:
Pavel Durst, Jaroslav Dušek, Karel Dusek, Denis Fros, David Busek, Martin Kozak, Petr Vesely, Kristina Sorokina
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
Electrochemical migration is one of the issues that appears due to specific conditions when the electrolytic solution is present between two neighbouring conductors with different electrical potentials. This article deals with a student’s workplace
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f49a993cae099d242743f6182d3188d5
https://doi.org/10.1109/isse51996.2021.9467605
https://doi.org/10.1109/isse51996.2021.9467605
Autor:
Petr Vesely, Denis Fros
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
The study attends to the evaluation of solder joints from a mechanical point of view. Two lead-free alloys Sn99.7Cu0.3 and Sn96.5Ag3Cu0.5 (SAC305) were selected for samples preparation. To compare the results of current alloys with the most utilized
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc7632293f1c0d51eed0ca1153c435d8
https://doi.org/10.1109/isse51996.2021.9467552
https://doi.org/10.1109/isse51996.2021.9467552
Autor:
Karel Dusek, Denis Fros
Publikováno v:
2020 43rd International Spring Seminar on Electronics Technology (ISSE).
The goal of this study is to evaluate the bond between the soldering pad and the substrate in dependence on the solder pad finish as well as on ambient temperature. Stated differently, measuring of pulling force necessary for detaching the pad from t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::caa4577806541320ff43cc57d2aebd86
https://doi.org/10.1109/isse49702.2020.9121111
https://doi.org/10.1109/isse49702.2020.9121111
Publikováno v:
Polymers
Polymers, Vol 13, Iss 3203, p 3203 (2021)
Volume 13
Issue 19
Polymers, Vol 13, Iss 3203, p 3203 (2021)
Volume 13
Issue 19
The purpose of this study was to compare the strength of the bond between resin and glass cloth for various composites (laminates) and its dependence on utilized soldering pad surface finishes. Moreover, the impact of surface finish application on th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::95059501dc655902457ff7753e902f28
https://doi.org/10.3390/polym13193203
https://doi.org/10.3390/polym13193203
Publikováno v:
Virtual and Physical Prototyping, Vol 18, Iss 1 (2023)
3D-printed electronics belong to new approaches to how to build a complex object with multiple desired functions. For that purpose, materials with specific electric properties are needed: conductors, insulators, magnetics, or dielectrics with high pe
Externí odkaz:
https://doaj.org/article/d8fd712bb22344c8942eb4798babee2c