Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Delande, Tinne"'
Autor:
Tsvetanova, Diana, Devriendt, Katia, Ong, Patrick, Vandeweyer, Tom, Delande, Tinne, Chew, Soon Aik, Horiguchi, Naoto, Struyf, Herbert
Publikováno v:
Proceedings of International Conference on Planarization/CMP Technology 2014; 2014, p199-202, 4p
Autor:
Pham, Nga. P., Daily, Robert, Armini, Silvia, Delande, Tinne, Pantouvaki, Marianna, Soussan, Philippe
Publikováno v:
2013 European Microelectronics Packaging Conference (EMPC); 2013, p1-4, 4p
Autor:
Vereecke, Guy, Xu, XiuMei, Tsai, Kang, Yang, Hui, Armini, Silvia, Delande, Tinne, Doumen, Geert, Kentie, Frank, Shi, Xiaoping, Simms, Ihsan, Nafus, Kathleen, Holsteyns, Frank, Struyf, Herbert, Gendt, Stefan De
Publikováno v:
ECS Transactions; August 2013, Vol. 58 Issue: 6 p171-182, 12p
Autor:
Xu, Xiu Mei, Vereecke, Guy, van den Hoogen, Erik, Smeers, Jens, Armini, Silvia, Delande, Tinne, Struyf, Herbert
Publikováno v:
Diffusion and Defect Data Part B: Solid State Phenomena; December 2012, Vol. 195 Issue: 1 p235-238, 4p
Autor:
Cui, Hushan, Van, Rita, Severi, Simone, Witvrouw, Ann, Knoops, An, Delande, Tinne, Pancken, Joris, Claes, Martine
Publikováno v:
ECS Transactions; October 2010, Vol. 33 Issue: 8 p295-307, 13p
Autor:
Li, Yunlong, Heylen, Nancy, Delande, Tinne, Kellens, Kristof, Ong, Patrick, Leunissen, Leonardus, Tarnowka, Alexandre, Eliyahu, Aviv
Publikováno v:
ECS Transactions; March 2009, Vol. 18 Issue: 1 p453-458, 6p
Autor:
Loo, Roger, Verheyen, Peter, Rooyackers, Rita, Walczyk, Christian, Leys, Frederik, Shamiryan, Denis, Absil, Philip, Delande, Tinne, Moussa, Alain, Weijtmans, Hans, Wise, Rick, Machkaoutsan, Vladimir, Arena, Chantal, McCormack, John, Passefort, Sophie, Sorada, Haruyuki, Inoue, Akira, Chan, Byeong, Hyun, Sangjin, Jakschik, Stefan, Caymax, Matty R., Eneman, Geert, Bender, Hugo, Drijbooms, Chris, Geenen, Luc, Tomasini, Pierre, Godny, Stephane
Publikováno v:
ECS Transactions; October 2006, Vol. 3 Issue: 7 p453-465, 13p
Autor:
Hellin, David, Fyen, Wim, Rip, Jens, Delande, Tinne, Mertens, Paul W., De Gendt, Stefan, Vinckier, Chris
Publikováno v:
JAAS (Journal of Analytical Atomic Spectrometry); 2004, Vol. 19 Issue: 12 p1517-1523, 7p
Publikováno v:
2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration; 1/ 1/2012, p153-153, 1p