Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Deepukumar M. Nair"'
Autor:
Bradley A. Thrasher, Deepukumar M. Nair, James M. Parisi, William E. McKinzie, Elizabeth D. Hughes, Michael A. Smith
Publikováno v:
IEEE Antennas and Wireless Propagation Letters. 15:1522-1525
This letter presents a 60-GHz $2 \times 2$ low temperature co-fired ceramic (LTCC) aperture-coupled patch antenna array with an integrated Sievenpiper electromagnetic band-gap (EBG) structure used to suppress TM-mode surface waves. The merit of this
Autor:
Bradley A. Thrasher, Deepukumar M. Nair, William E. McKinzie, James M. Parisi, Allan Beikmohamadi, Elizabeth D. Hughes, Michael A. Smith
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:000067-000072
Presented here are the design, fabrication, and measurement results of a low temperature cofired ceramic (LTCC) chip-to-interposer transition utilizing a flip-chip ball grid array (BGA) interconnect that provides excellent electrical performance up t
Autor:
Deepukumar M. Nair, Bradley A. Thrasher, Patricia Graddy, Allan Beikmohamadi, James M. Parisi
Publikováno v:
International Symposium on Microelectronics. 2014:000687-000691
In an effort to address the impact of rising gold costs on the fabrication expense for high frequency circuits, and maintain circuit quality and reliability, the DuPont™ GreenTape™ 9K7 low temperature co-fired ceramic materials (LTCC) with top si
Autor:
Jim Parisi, Michael A. Zimmerman, Glenn Oliver, Meredith L. Dunbar, Scavuzzo William S, Deepukumar M. Nair, Richard A. Wessel, Bradley A. Thrasher, Thomas Edward Carney, Keith Smith
Publikováno v:
International Symposium on Microelectronics. 2014:000460-000465
Novel LCP films have been developed by iQLP, LLC in a Joint Development effort with Dupont, for commercialization in the Printed Circuit Board (PCB) industry, for high frequency applications. The films will be commercialized as Copper Clad Laminate (
Autor:
K. M. Nair, Steve Stewart, K.E. Souders, Michael Farb, J.C. Malerbi, Jim Parisi, Mark McCombs, Michael A. Smith, Deepukumar M. Nair, Allan Beikmohamadi
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000283-000287
Low Temperature Co-fired Ceramic (LTCC) technology provides an attractive packaging platform for microwave and millimeter wave circuits and systems due to its unique properties. Generally, thick film gold or silver conductors are used as metallizatio
Publikováno v:
International Symposium on Microelectronics. 2013:000678-000682
Low Temperature Co-fired Ceramic (LTCC) with low dielectric loss is suitable for use on microwave and millimeter wave circuits. Thick film gold or silver conductors are used as metallization on LTCC substrates. Gold prices are increasing at a rapid r
Publikováno v:
International Symposium on Microelectronics. 2011:000740-000746
Low Temperature Co-fired Ceramic (LTCC) material systems offer a highly versatile microwave and millimeter wave packaging platform. Extremely low microwave loss, excellent control of dielectric constant, uniform dielectric thickness, non-existent wat
Autor:
Scott Gordon, Bradley A. Thrasher, Deepukumar M. Nair, Elizabeth D. Hughes, James M. Parisi, Mark McCombs, K.E. Souders, Stephen C. Beers, J.C. Malerbi, K. M. Nair, Michael A. Smith, Anthony Orzel
Publikováno v:
International Symposium on Microelectronics. 2011:000544-000552
Low Temperature Co-fired Ceramic (LTCC) material systems have been successfully used in microwave and millimeter wave systems for several years. LTCC has very low dielectric loss, high reliability due to inherent hermeticity; high interconnect densit
Autor:
James M. Parisi, Ken E. Souders, Bradley A. Thrasher, Mark Frederick Mccombs, Tim P. Mobley, Michael Arnett Smith, Kumaran Manikantan Nair, Deepukumar M. Nair
Publikováno v:
International Symposium on Microelectronics. 2010:000242-000247
The demand for cost effective LTCC systems has led to increasing use of silver based thick film conductors for inner layers of RF modules. There exists some level of concern about the reliability of silver as a conducting material for electronic circ
Publikováno v:
International Symposium on Microelectronics. 2012:001078-001080
Organic coverlays are required to protect microstrip circuits in most applications. The presence of coverlay can potentially influence the performance of microstrip antennas. This paper describes the qualification of polyimide based coverlays for mic