Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Deepu S. R."'
Publikováno v:
MATEC Web of Conferences, Vol 144, p 04010 (2018)
Intensifying electronic component power dissipation levels, shortening product design cycle times, and greater than before requirement for more compact and reliable electronic systems with greater functionality, has heightened the need for thermal de
Externí odkaz:
https://doaj.org/article/c6ff0fa2e62342b3bc60aab95ec2d155
Publikováno v:
AIP Conference Proceedings; 2021, Vol. 2396 Issue 1, p1-11, 11p