Zobrazeno 1 - 1
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pro vyhledávání: '"Deepti Iyengar"'
Autor:
Robert L. Sankman, Yidnekachew S. Mekonnen, Kemal Aygun, Sujit Sharan, Islam A. Salama, Ravi Mahajan, Neha M. Patel, Deepti Iyengar, Dae-Woo Kim, Debendra Mallik, Zhi-Guo Qian
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
The EMIB dense MCP technology is a new packaging paradigm that provides localized high density interconnects between two or more die on an organic package substrate, opening up new opportunities for heterogeneous on-package integration. This paper pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8f59eeba0c4d8edf8836ae5e2a5728c5
https://doi.org/10.1109/ectc.2016.201
https://doi.org/10.1109/ectc.2016.201
