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pro vyhledávání: '"Dean R Denison"'
Autor:
Justin K. Wang, Dean R. Denison
Publikováno v:
SPIE Proceedings.
Wafer fabrication technology is rapidly advancing toward three or four layers of metalization with geometry of 0.35 micrometers and smaller, with aspect ratios of 3:1, and a requirement that the interlayer dielectric be globally planarized. Electron
Publikováno v:
SPIE Proceedings.
An electron cyclotron resonance (ECR) generated oxygen plasma has been used for the chemical vapor deposition (CVD) of Si02 by reacting the oxygen plasma beam with adsorbed silane. This study was done to define the process window for the deposition o
Autor:
Dean R. Denison
Publikováno v:
Journal of Vacuum Science and Technology. 6:214-217
Autor:
Jeffrey I. Steinfeld, Larry D. Hartsough, Dean R Denison, F. Read McFeely, David Harradine, Bobbi Roop, John R. Hollahan
Publikováno v:
SPIE Proceedings.
Reactive etching at silicon and silicon-oxide surfaces is customarily carried out in a fluorocarbon plasma. Under such conditions, a large variety of reactive species is generated, making it extremely difficult to elucidate details of the etching mec
Periodical
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