Zobrazeno 1 - 10
of 39
pro vyhledávání: '"Dean Malta"'
Autor:
Josephine Chang, Ryan Walsh, Fadi Afiouni, Thomas Spence, Nicholas Edwards, Kieran Perkins, Sean McLoughlin, Matthew Lueck, Jennifer Ovental, Dean Malta, Charles F. Campbell, Deep Dumka, Paul Schmid
Publikováno v:
2022 IEEE International Symposium on Phased Array Systems & Technology (PAST).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::da8022f8a29657fdbd40e76fc38e7627
https://doi.org/10.1109/past49659.2022.9975048
https://doi.org/10.1109/past49659.2022.9975048
Autor:
Daniel P. Violette, Jennifer Ovental Hicks, Dean Malta, David Bordelon, Jonathan E. Grindlay, Hiromasa Miyasaka, Daniel Richter, Jaesub Hong, Branden E. Allen
This paper will describe the use of through-silicon vias (TSVs) in a readout application-specific integrated circuit (ASIC) chip to replace wire bonds in the assembly of cadmium zinc telluride (CZT) X-ray detector arrays for space telescope applicati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::351b020c5938b3f501013ab4124213ee
https://resolver.caltech.edu/CaltechAUTHORS:20211123-164455637
https://resolver.caltech.edu/CaltechAUTHORS:20211123-164455637
Autor:
Jaesub Hong, Branden E. Allen, Daniel Richter, Hiromasa Miyasaka, Jennifer Ovental, Dean Malta, David Bordelon, Daniel E. Violette, Jonathan E. Grindlay
Application-specific integrated circuits (ASICs) are commonly used to efficiently process the signals from sensors and detectors in space. Wire bonding is a space-qualified technique of making interconnections between ASICs and their substrate packag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::688c1105683e7af1f0c42953bcdee22b
https://resolver.caltech.edu/CaltechAUTHORS:20210318-162735516
https://resolver.caltech.edu/CaltechAUTHORS:20210318-162735516
Autor:
Dorota Temple, Marianne Butler, Alan Huffman, Allan Hilton, Christopher Gregory, John Lannon, Dean Malta
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:153-157
An electrically functional freestanding Si interposer for 3-D heterogeneous integration applications is designed and successfully fabricated. The interposer employs multilevel metallization (MLM) on the frontside of the wafer and Cu-filled through-Si
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::99068ecece26ca33b33bad01944b1b70
https://doi.org/10.1109/tcpmt.2013.2284580
https://doi.org/10.1109/tcpmt.2013.2284580
Autor:
Nathan Bushyager, Sharon Woodruff, Parrish Ralston, Erik Vick, G. David Ebner, Matthew Lueck, Christopher Hillman, Alan Huffman, Jonathan Hacker, Jeffrey Hartman, Adam Young, Stuart Quade, Dean Malta
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
We report a TSV-last, heterogeneous 3D integration process for millimeter wave solid state tiles for use in the demonstration of a W-band active electronically scanned array (AESA) radar system. Each phased array tile consists of a high speed SiGe Bi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aaeca6e02bb8a4370dfe05ba5da6fe6b
https://doi.org/10.1109/ectc.2016.103
https://doi.org/10.1109/ectc.2016.103
Autor:
Christopher Gregory, Alan Huffman, M. R. Skokan, J. E. Robinson, P. R. Coffman, Dean Malta, Terry Welch, Dorota Temple, John Lannon, Matthew Lueck
Publikováno v:
ECS Transactions. 16:3-13
Modern electronic applications demand more and more complex, multifunctional microsystems with performance characteristics which can only be achieved by using best-of-breed materials and device technologies. Three-dimensional (3-D) integration of sep
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3d970706100cdd4762bdba0cf3055c2f
https://doi.org/10.1149/1.2982849
https://doi.org/10.1149/1.2982849
Autor:
Erik P. Vick, M. R. Skokan, Mark S. Muzilla, Dean Malta, Christopher M. Masterjohn, Dorota Temple, Matthew Lueck
Publikováno v:
Quantum Sensing and Nanophotonic Devices XII.
Staring infrared focal plane arrays (FPAs) require pixel-level, three-dimensional (3D) integration with silicon readout integrated circuits (ROICs) that provide detector bias, integrate detector current, and may further process the signals. There is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1d9eaa578d5571ea7b629776ce2f628c
https://doi.org/10.1117/12.2082877
https://doi.org/10.1117/12.2082877
Autor:
Mark S. Muzilla, M. R. Skokan, Scott Goodwin, Dorota Temple, Christopher M. Masterjohn, Dean Malta, Erik Vick, Matthew Lueck
Publikováno v:
3DIC
We report successful implementation of high-density 3D integration technology in the fabrication of advanced mixed-signal processors for infrared focal plane arrays. Separate analog and digital integrated circuits (ICs) were custom designed and fabri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2519b3dbba44bf93475693664182f9b
https://doi.org/10.1109/3dic.2014.7152142
https://doi.org/10.1109/3dic.2014.7152142
Publikováno v:
2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
We will review the status of the implementation of high density area array 3D integration technology relying on low temperature metal-metal bonds in functional infrared imaging systems, and will discuss scaling of the technology for compatibility wit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5f44fb68c3431cff95465d55dc914a03
https://doi.org/10.1109/ltb-3d.2014.6886146
https://doi.org/10.1109/ltb-3d.2014.6886146
Autor:
Dean Malta
Publikováno v:
Handbook of 3D Integration: 3D Process Technology
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fe113b0e79399af2043963461296d6b3
https://doi.org/10.1002/9783527670109.ch05
https://doi.org/10.1002/9783527670109.ch05