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pro vyhledávání: '"De Preter, Inge"'
Autor:
Hou, Lin, Derakhshandeh, Jaber, Armini, Silvia, Gerets, Carine, De Preter, Inge, June Rebibis, Kenneth, Miller, Andy, De wolf, Ingrid, Beyne, Eric
Publikováno v:
AMC 2015 – Advanced Metallization Conference
In this paper SAM (self-assembled monolayers) is used to passivate cobalt microbumps for 3D-stacking of Si chips. The SAM deposition process is optimized, using input from characterization techniques such as water contact angle measurement, ATR, AFM
Autor:
De Preter, Inge, Derakhshandeh, Jaber, Heylen, Nancy, Van Acker, Lut, June Rebibis, Kenneth, Miller, Andy, Beyer, Gerald, Beyne, Eric
Publikováno v:
AMC 2015 – Advanced Metallization Conference
Planarization techniques such as Surface planer (better known as Fly-cut) and chemical-mechanical polishing (CMP) can be used to improve the bump roughness and bump height uniformity within the die and wafer which can be beneficial for solder based b
Autor:
Vakanas, George, Minho, O., Dimcic, Biljana, Vanstreels, Kris, Vandecasteele, Bjorn, De Preter, Inge, Derakhshandeh, Jaber, Rebibis, Kenneth, Kajihara, Masanori, De Wolf, Ingrid, Beyne, Eric
Publikováno v:
In Microelectronic Engineering 1 June 2015 140:72-80
Akademický článek
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Autor:
Vakanas, George, Dimcic, Biljana, O, Minho, Vanstreels, Kris, Vandecasteele, Bjorn, De Preter, Inge, Derakhshandeh, Jaber, Rebibis, Kenneth, Kajihara, Masanori, De Wolf, Ingrid, Beyne, Eric
Display Omitted Co-Sn intermetallics growth is faster than Cu-Sn IMC which is faster than Ni-Sn IMC.Co-Sn intermetallics growth is inhibited by the presence of Cu dopants/additives.Co oxides are cleanable with Ar/H2 microwave plasma or Rosin-based so
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8cd1ec2b797b5802f129bb400bb50b88
http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100699417
http://t2r2.star.titech.ac.jp/cgi-bin/publicationinfo.cgi?q_publication_content_number=CTT100699417
Autor:
Lin Hou, Derakhshandeh, Jaber, De Preter, Inge, Vandersmissen, Kevin, Rebibis, Kenneth June, Miller, Andy, Beyne, Eric, De Wolf, Ingrid
Publikováno v:
2016 6th Electronic System-Integration Technology Conference (ESTC); 2016, p1-5, 5p
Autor:
De Preter, Inge, Derakhshandeh, Jaber, Lin Hou, Gerets, Carine, Teng Wang, Rebibis, Kenneth June, Miller, Andy, Beyer, Gerald, Beyne, Eric
Publikováno v:
2016 6th Electronic System-Integration Technology Conference (ESTC); 2016, p1-5, 5p
Publikováno v:
European Coatings Journal. 2015, Issue 10, p38-44. 7p.
Autor:
Derakhshandeh, Jaber, De Preter, Inge, Vandersmissen, Kevin, Dictus, Dries, Di Piazza, Luca, Hou, Lin, Guerrieri, Stefano, Vakanas, George, Armini, Silvia, Daily, Robert, Lesniewska, Alicja, Vandelaer, Yannick, Van De Peer, Myriam, Slabbekoorn, John, Rebibis, Kenneth June, Miller, Andy, Beyer, Gerald, Beyne, Eric
Publikováno v:
2015 IEEE International Interconnect Technology Conference & 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM); 2015, p221-224, 4p
Autor:
Derakhshandeh, Jaber, De Preter, Inge, England, Luke, Schmid, Daniel, Slabbekoorn, John, Vakanas, George, Wang, Teng, Beyer, Gerald, Beyne, Eric, Marinissen, Erik Jan, Rebibis, Kenneth June, Lerch, Wilfried, Miller, Andy
Publikováno v:
Proceedings of the 5th Electronics System-integration Technology Conference (ESTC); 2014, p1-5, 5p