Zobrazeno 1 - 10
of 137
pro vyhledávání: '"Dazeng, Feng"'
Autor:
John E. Cunningham, Ashok V. Krishnamoorthy, Kannan Raj, Roshanak Shafiiha, Mehdi Asghari, Shirong Liao, Cheng-Chih Kung, Joan Fong, Jin-Hyoung Lee, Dazeng Feng, Jin Yao, Hiren Thacker, Ivan Shubin, Guoliang Li, Xuezhe Zheng, Ying Luo
Publikováno v:
Micromachines, Vol 3, Iss 2, Pp 345-363 (2012)
We have investigated the selective epitaxial growth of GeSi bulk material on silicon-on-insulator substrates by reduced pressure chemical vapor deposition. We employed AFM, SIMS, and Hall measurements, to characterize the GeSi heteroepitaxy quality.
Externí odkaz:
https://doaj.org/article/855d77c5c3cd477a81a914ee9ab72c13
Autor:
Longsheng, Wu, Yue, Zhou, Yan, Cai, Xiyuan, Cao, Ruxue, Wang, Minghao, Qi, Joan, Fong, Dazeng, Feng, Aimin, Wu
Publikováno v:
Optics express. 28(5)
We present the design of an adiabatic taper coupled Ge
Autor:
Ruxue Wang, Aimin Wu, Minghao Qi, Dazeng Feng, Yue Zhou, Xiyuan Cao, Joan Fong, Longsheng Wu, Yan Cai
Publikováno v:
Optics Express. 28:7585
We present the design of an adiabatic taper coupled Ge1−xSi x electro-absorption modulator, which is based on Franz-Keldysh effect. The device has an active region of 0.8×50 µm2, an extinction ratio of more than 6 dB and an insertion loss less th
Autor:
Mehdi Asghari, Zhou Zhou, Jacob S. Levy, Wei Qian, Roshanak Shafiiha, Hong Liang, Joan Fong, B. Jonathan Luff, Zhi Li, Cheng-Chih Kung, Dazeng Feng
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. 19:64-73
Following significant research and development work over the past few years, silicon photonics has become a promising candidate to provide low-power, low-cost, and high-speed photonic links for telecommunication, data communication, and interconnect
Publikováno v:
Optical Fiber Communication Conference.
Silicon photonics VOAs (variable optical attenuators) have been manufactured for the past several years in quantities of 100,000s per year. Can the lessons of high-volume VOA production apply to 100Gb/s silicon photonics transceivers as they scale be
Autor:
Jin Yao, Shirong Liao, Ashok V. Krishnamoorthy, Dazeng Feng, Ivan Shubin, Cheng-Chih Kung, John E. Cunningham, Ying Luo, Xuezhe Zheng, Jin-Hyoung Lee, Kannan Raj, Joan Fong, Hiren D. Thacker, Mehdi Asghari, Guoliang Li, Roshanak Shafiiha
Publikováno v:
Micromachines, Vol 3, Iss 2, Pp 345-363 (2012)
Micromachines
Volume 3
Issue 2
Pages 345-363
Micromachines
Volume 3
Issue 2
Pages 345-363
We have investigated the selective epitaxial growth of GeSi bulk material on silicon-on-insulator substrates by reduced pressure chemical vapor deposition. We employed AFM, SIMS, and Hall measurements, to characterize the GeSi heteroepitaxy quality.
Autor:
Dazeng Feng, Hiren D. Thacker, Kannan Raj, Guoliang Li, Thierry Pinguet, J. E. Cunningham, Jin Yao, Eugene M. Chow, D C Lee, James G. Mitchell, Jon Lexau, Ying Luo, Xuezhe Zheng, Ron Ho, Mehdi Asghari, Ashok V. Krishnamoorthy, Ivan Shubin
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. 17:546-558
The technologies associated with integration and packaging have a significant impact on the overall system. In this paper, we review a silicon photonic “macrochip” system and its associated packaging that will allow dense wavelength-division mult
Autor:
Herb Schwetman, Mehdi Asghari, Ron Ho, Dinesh Patil, Thierry Pinguet, Dazeng Feng, Jon Lexau, W. Y. Jan, Xuezhe Zheng, Frankie Liu, J. E. Cunningham, Ashok V. Krishnamoorthy, Keith W. Goossen, Guoliang Li, R.G. Rozier
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. 17:357-376
Optical links have successfully displaced electrical links when their aggregated bandwidth-distance product exceeds ~100 Gb/s-m because their link energy per bit per unit distance is lower. Optical links will continue to be adopted at distances of 1
Autor:
John E. Cunningham, Hong Liang, M. Asghari, Xuezhe Zheng, John Simons, A.V. Krishnamoorthy, I. Shubin, Cheng-Chih Kung, Dazeng Feng
Publikováno v:
IEEE Journal of Quantum Electronics. 45:409-414
We report high-fidelity 10-Gb/s optical-proximity-communication using reflecting mirrors micro-machined into silicon and co-integrated with low-loss silicon-on-insulator waveguides for packaged chip-to-chip communication. Device integration was carri
Autor:
Ying Luo, Hiren D. Thacker, Xuezhe Zheng, P. Amberg, John E. Cunningham, Shiyun Lin, Kannan Raj, Frankie Liu, Roshanak Shafiiha, Arin Abed, Dazeng Feng, Ivan Shubin, Jin-Hyoung Lee, Ron Ho, Hong Liang, Eric Chang, Jin Yao, John Simons, Ashok V. Krishnamoorthy, Stevan S. Djordjevic, Jon Lexau, Mehdi Asghari
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
We present the packaging of a large multi-chip energyefficient WDM silicon photonic interconnect prototype enabled by hybrid integration, high-accuracy optical alignment and thermal-mechanical aware design and assembly.