Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Dayo Oshinubi"'
Autor:
Nicola Massari, Alessandro Tontini, Luca Parmesan, Matteo Perenzoni, Milos Gruijc, Ingrid Verbauwhede, Thomas Strohm, Dayo Oshinubi, Ingo Herrmann, Andreas Brenneis
Publikováno v:
ESSCIRC 2022- IEEE 48th European Solid State Circuits Conference (ESSCIRC).
ispartof: pages:73-76 ispartof: ESSCIRC 2022- IEEE 48TH EUROPEAN SOLID STATE CIRCUITS CONFERENCE (ESSCIRC) pages:73-76 ispartof: 48th IEEE European Solid State Circuits Conference (ESSCIRC) location:ITALY, Milan date:19 Sep - 22 Sep 2022 status: publ
Publikováno v:
Microsystem Technologies. 21:429-443
This paper reports on real-time offset calibration of a three-axis gyroscope whereby the angular rate sensor is part of an IMU in the field. If the IMU is in motion, the orientation changes of the gyroscope can be compared with those from other calib
Publikováno v:
IEEE Transactions on Instrumentation and Measurement. 63:96-105
In this paper, the self-calibration of micromechanical acceleration sensors is considered, specifically, based solely on user-generated movement data without the support of laboratory equipment or external sources. The autocalibration algorithm itsel
Publikováno v:
2013 IEEE Sensors Applications Symposium Proceedings.
This paper reports on realtime offset calibration of a three-axis gyroscope, especially, offset calibration of a gyroscope exclusively based on the redundant information of one three-axis accelerometer. The self calibration is based on the knowledge
Autor:
Christian Rettig, Dayo Oshinubi, Karl-Franz Reinhart, Tjalf Pirk, Edda Sommer, Ingo Herrmann, Mirko Hattass
Publikováno v:
Advanced Microsystems for Automotive Applications 2011 ISBN: 9783642213809
In the EU FP7 project "ADOSE" a new approach has been used to develop a new cost efficient technology by adapting a volume proven integrated MEMS process for the production of a suspended thermodiode array. As low-cost was to be the key feature of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::59e26d8bb0e012d39474978155588e3a
https://doi.org/10.1007/978-3-642-21381-6_9
https://doi.org/10.1007/978-3-642-21381-6_9
Autor:
Ingo Herrmann, Martin Eckardt, F. Freund, Dayo Oshinubi, Edda Sommer, Volker Krüger, U. Kunz, Ando Feyh, K.-F. Reinhart, Tjalf Pirk
Publikováno v:
Procedia Engineering
A new low-cost process for mid resolution FIR-Arrays for thermal imaging in the LWIR range (8- 14 μm) has been developed. Integrated array devices with 1k and 5k pixel array size have been designed and manufactured using this process which is fully