GRAS 31 Flavoring Substances.

Autor: Rietjens, I. M. C. M., Cohen, S. M., Eisenbrand, G., Fukushima, S., Gooderham, N. J., Guengerich, F. P., Hecht, S. S., Rosol, T. J., Davidsen, J. M., Harman, C., Ramanan, D., Taylor, S. V.

Publikováno v: Food Technology; May2024, Vol. 78 Issue 4, p44-62, 19p

Safety and efficacy of a feed additive consisting of an essential oil derived from the flowering tops of Lavandula angustifolia Mill. (lavender oil) for use in all animal species (FEFANA asbl).

Autor: Villa, Roberto Edoardo (AUTHOR), Azimonti, Giovanna (AUTHOR), Bonos, Eleftherios (AUTHOR), Christensen, Henrik (AUTHOR), Durjava, Mojca (AUTHOR), Dusemund, Birgit (AUTHOR), Gehring, Ronette (AUTHOR), Glandorf, Boet (AUTHOR), Kouba, Maryline (AUTHOR), López‐Alonso, Marta (AUTHOR), Marcon, Francesca (AUTHOR), Nebbia, Carlo (AUTHOR), Pechová, Alena (AUTHOR), Prieto‐Maradona, Miguel (AUTHOR), Röhe, Ilen (AUTHOR), Theodoridou, Katerina (AUTHOR), Bastos, Maria de Lourdes (AUTHOR), Brantom, Paul (AUTHOR), Chesson, Andrew (AUTHOR), Schlatter, Josef (AUTHOR)

Publikováno v: EFSA Journal. Oct2024, Vol. 22 Issue 10, p1-22. 22p.

Studi Senyawa Perisa pada Online Marketplaces di Indonesia: Jenis Senyawa Perisa dan Legalitasnya.

Autor: Agustina, Lenny¹, Lioe, Hanifah Nuryani², Andarwulan, Nuri^2,3 andarwulan@apps.ipb.ac.id

Publikováno v: Journal of Food Technology & Industry / Jurnal Teknologi & Industri Pangan. Jun2024, Vol. 35 Issue 1, p27-45. 19p.

Morphology evolution of the light trapping structure using atmospheric plasma textured c-Si wafer for silicon solar cells.

Autor: Zhang, Peng, Wu, Jie, Tian, Hengxi, Dong, Yuqing, Yu, Deping

Publikováno v: Journal of Applied Physics; 7/14/2021, Vol. 130 Issue 2, p1-11, 11p

Photonics for Neuromorphic Computing: Fundamentals, Devices, and Opportunities.

Autor: Li R; School of Science and Engineering, Guangdong Key Laboratory of Optoelectronic Materials and Chips, Shenzhen Key Lab of Semiconductor Lasers, The Chinese University of Hong Kong, Shenzhen, Shenzhen, Guangdong, 518172, China., Gong Y; School of Science and Engineering, Guangdong Key Laboratory of Optoelectronic Materials and Chips, Shenzhen Key Lab of Semiconductor Lasers, The Chinese University of Hong Kong, Shenzhen, Shenzhen, Guangdong, 518172, China., Huang H; School of Science and Engineering, Guangdong Key Laboratory of Optoelectronic Materials and Chips, Shenzhen Key Lab of Semiconductor Lasers, The Chinese University of Hong Kong, Shenzhen, Shenzhen, Guangdong, 518172, China., Zhou Y; School of Science and Engineering, Guangdong Key Laboratory of Optoelectronic Materials and Chips, Shenzhen Key Lab of Semiconductor Lasers, The Chinese University of Hong Kong, Shenzhen, Shenzhen, Guangdong, 518172, China., Mao S; School of Science and Engineering, Guangdong Key Laboratory of Optoelectronic Materials and Chips, Shenzhen Key Lab of Semiconductor Lasers, The Chinese University of Hong Kong, Shenzhen, Shenzhen, Guangdong, 518172, China., Wei Z; SONT Technologies Co. LTD, Shenzhen, Guangdong, 510245, China., Zhang Z; School of Science and Engineering, Guangdong Key Laboratory of Optoelectronic Materials and Chips, Shenzhen Key Lab of Semiconductor Lasers, The Chinese University of Hong Kong, Shenzhen, Shenzhen, Guangdong, 518172, China.

Publikováno v: Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2024 Jun 21, pp. e2312825. Date of Electronic Publication: 2024 Jun 21.