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pro vyhledávání: '"David W. Burns"'
Autor:
David W. Burns
Can a monster choose to be good?That's the question facing Kyra Anastas. With snakes for hair and a gaze that turns men to stone, Kyra is a modern-day Medusa, making a living in Chicago as a hitwoman for hire. Feared and hated even by her fellow Myth
Publikováno v:
Sensors and Actuators A: Physical. 53:249-255
Resonant microbeam strain-sensing elements have been combined with a highly symmetric multiwafer silicon microstructure to form the first micromachined accelerometer with a polysilicon resonant microbeam pickoff. The MARIMBA (micromachined resonant i
Publikováno v:
Sensors and Actuators A: Physical. 52:92-98
Optically excited self-resonance of polysilicon microbeams sealed in a cofabricated vacuum enclosure has been achieved. Unmodulated low-power laser diodes from 650 to 840 nm have been used to excite resonances ranging from 65 to 750 kHz on microbeams
Autor:
David W. Burns
Publikováno v:
MEMS Reference Shelf ISBN: 9780387473161
Wet chemical etching through openings in photoresist or hard masks underlies many process sequences for MEMS device fabrication. This chapter presents more than 800 wet-etch recipes for over 400 varieties and combinations of substrates and deposited
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a64fc1f1f985dab94c72b6e125f29c6
https://doi.org/10.1007/978-0-387-47318-5_8
https://doi.org/10.1007/978-0-387-47318-5_8
Publikováno v:
Sensors and Actuators A: Physical. 35:51-59
Polysilicon resonant microbeams can be used as strain-sensitive elements to replace conventional silicon piezoresistors in precision sensor applications, such as pressure sensors and accelerometers. These elements are combined with conventional silic
Publikováno v:
Technical Digest IEEE Solid-State Sensor and Actuator Workshop.
Advances have been made in the fabrication and testing of polysilicon resonant microbeams for application to high performance pressure sensors and accelerometers. Fabrication efforts have centered on three issues: interface integrity, sealing with re
Publikováno v:
TRANSDUCERS '91: 1991 International Conference on Solid-State Sensors and Actuators. Digest of Technical Papers.
Vacuum-enclosed resonant microbeam elements 200 or 400 mu m long and 1.8 mu m thick have been fabricated using LPCVD (low-pressure chemical vapor deposited) mechanical-grade polysilicon. The fundamental resonant frequency and overtone frequencies of
Autor:
Decai Sun, Jen-Tsorng Chang, Chuang-Chia Lin, Janusz Bryzek, Jim Calamita, David W. Burns, Jingkuang Chen, Vladimir L. Rabinovich, Andrew J Zosel, John R Gilbert, Alex T. Tran, Anis Husain, Bill Nowak, Thomas E. Plowman, Charles Hsu, Joel A Kubby, Bruce R. Scharf, Peter M. Gulvin, Shifang Zhou, Tom Pumo, Raji Mali, Li Fan, Troy D. Daiber, Yi Su, Jim Hartman, Steve Delvecchio, Arthur S. Morris, Tom Korsmeyer, Robert M. Lofthus, Michel A. Rosa, Nena Golubovic-Laikopoulos
Publikováno v:
SPIE Proceedings.
A multidisciplinary team of end users and suppliers has collaborated to develop a novel yet broadly enabling process for the design, fabrication and assembly of Micro-Opto- Electro-Mechanical Systems (MOEMS). A key goal is to overcome the shortcoming
Publikováno v:
1996 Solid-State, Actuators, and Microsystems Workshop Technical Digest.
Publikováno v:
SPIE Proceedings.
The Honeywell Technology Center, in collaboration with the University of Wisconsin and the Mobil Corporation, and under funding from this ARPA sponsored program, are developing a new type of `hybrid' micromachined silicon/fiber optic sensor that util