Zobrazeno 1 - 3
of 3
pro vyhledávání: '"David Trapp"'
Publikováno v:
Physics World. 35:30i-30i
A response to Matin Durrani’s comment article “What’s in a name?”, which discusses the question of whether to rename projects and scientific terms that have been called after historical figures who might have held views we would now consider
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::78a78e2c9d03aa165d136358641ce76f
https://doi.org/10.1088/2058-7058/35/03/25
https://doi.org/10.1088/2058-7058/35/03/25
Publikováno v:
International Symposium for Testing and Failure Analysis.
X-ray microscopy has the potential to solve many failure analysis problems associated with advanced package technologies because of its ability to non-destructively inspect advanced multi-layer package designs. In addition, x-ray imaging has the pote
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a2ae68f6876d75328018d13b8543f717
https://doi.org/10.31399/asm.cp.istfa2004p0094
https://doi.org/10.31399/asm.cp.istfa2004p0094
A Transmission X-ray Microscope (TXM) for Non-destructive 3D Imaging of ICs at Sub-100 nm Resolution
Autor:
David Trapp, Suneeta Neogi, Christopher Kelly, Casey Bennet, Frederick William Duewer, Kenneth W. Nill, Souping Yan, Markus Kuhn, David Scott, Peter Coon, Steve Wang, Wenbing Yun, Shashidar Kamath, Alan Lyon
Publikováno v:
International Symposium for Testing and Failure Analysis.
Xradia has developed a laboratory table-top transmission x-ray microscope, TXM 54-80, that uses 5.4 keV x-ray radiation to nondestructively image buried submicron structures in integrated circuits with at better than 80 nm 2D resolution. With an inte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::343206f184a2dda2f0ddd654810acd6a
https://doi.org/10.31399/asm.cp.istfa2002p0227
https://doi.org/10.31399/asm.cp.istfa2002p0227