Zobrazeno 1 - 7
of 7
pro vyhledávání: '"David Soon Wee Ho"'
Autor:
Sajay Bhuvanendran Nair Gourikutty, Ming Chinq Jong, Chockanathan Vinoth Kanna, David Soon Wee Ho, Seit Wen Wei, Sharon Lim Pei Siang, Jiaqi Wu, Teck Guan Lim, Rathin Mandal, Jason Tsung-Yang Liow, Surya Bhattacharya
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::704eecc72e2321a35bc1f1506940f8b9
https://doi.org/10.1109/ectc51906.2022.00074
https://doi.org/10.1109/ectc51906.2022.00074
Autor:
Hsiang-Yao Hsiao, David Soon Wee Ho, Ser Choong Chong, Tai Chong Chai, David Schutzberger, Yariv Oz, Guy Amrani
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::32974357557bbf740edf12ae9d53f794
https://doi.org/10.1109/eptc53413.2021.9663959
https://doi.org/10.1109/eptc53413.2021.9663959
Autor:
Sajay Bhuvanendran Nair Gourikutty, Ming Chinq Jong, Chockanathan Vinoth Kanna, David Soon Wee Ho, Jiaqi Wu, Rathin Mandal, Nanxi Li, Teck Guan Lim, Jason Tsung-Yang Liow, Surya Bhattacharya
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::911cad6d159965ffd102b73636077ff3
https://doi.org/10.1109/eptc53413.2021.9663971
https://doi.org/10.1109/eptc53413.2021.9663971
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Fan-out Wafer Level Packaging (FOWLP) is a versatile semiconductor packaging technology which can be used for various RF and Digital applications. In the FOWLP technology, the bare die IC is embedded in a molding compound for protection, and a Redist
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::171aae7c31e05a75642e33ba239bf3e3
https://doi.org/10.1109/ectc.2019.00143
https://doi.org/10.1109/ectc.2019.00143
Publikováno v:
2012 6th European Conference on Antennas and Propagation (EUCAP).
A 2×2 co-planar patch array on benzocyclobutene (BCB) membrane backed by low-loss polymer-filled cavities is designed and verified by measurement at 135GHz. The backing cavity is designed to enhance the antenna gain as well as to provide mechanical
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4c57f5cf288efe14b7f3447425e73ed8
https://doi.org/10.1109/eucap.2012.6206579
https://doi.org/10.1109/eucap.2012.6206579
Publikováno v:
2011 International Workshop on Antenna Technology (iWAT).
This work presents a co-planar patch array on silicon/benzocyclobutene (BCB) with polymer-filled cavities operating at 135 GHz. Backed by a polymer-filled cavity, a single co-planar patch can achieve gain enhancement of 2 dB. The presence of the poly
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::644e1f4214464d0a675369c242d1e9a8
https://doi.org/10.1109/iwat.2011.5752313
https://doi.org/10.1109/iwat.2011.5752313
Autor:
Xiaowu Zhang, Jong Kai Lin, Wickramanayaka, Sunil, Songbai Zhang, Weerasekera, Roshan, Dutta, Rahul, Ka Fai Chang, King-Jien Chui, Hong Yu Li, David Soon Wee Ho, Liang Ding, Katti, Guruprasad, Bhattacharya, Suryanarayana, Dim-Lee Kwong
Publikováno v:
Applied Physics Reviews; 2015, Vol. 2 Issue 2, p1-58, 58p