Zobrazeno 1 - 2
of 2
pro vyhledávání: '"David Skilbred"'
Autor:
Katherine Sieg, Christopher R. Carr, Karsten Schaefer, M. F. Chen, Christopher L. Borst, David Skilbred, Jong-heun Lim, Kosta Culafi, Milo Tallon, Norman Fish, Frank Robertson, Chulgi Song, John Hagwood, Anne-Sophie Larrea, Angelo Alaestante, Mark Kelling, ChungJu Yang, Denis Sullivan, WenLi Collision, Nithin Yathapu, Hsi-Wen Liu, Yii-Cheng Lin, Cheng-Chung Chien, Erin Fria, Regina Swaine, Gerard Stapf, Dan Franca, BumKi Moon, K. K. W. Lee, Bruce Gall, Jamie Prudhomme, Yu-Lieh Fu, Alexander Bialy, Stock Chang, Shannon Dunn, Michael Bryant, Lin Pinyen, Huey-Ming Wang, Joe Maniscalco, Richard Conti, Rand Cottle, Barry Wang, Steven Smith, Sun-OO Kim
Publikováno v:
2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).
At 450mm wafer area, the first Cu BEOL module process was demonstrated with a single damascene structure using low-k ILD, TiN metal hard mask and guided 20nm half-pitched lamella BCP DSA patterning. It showed the potential opportunities, technical fe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::16f5a6641fe5a8a4871bd779ed63e8be
https://doi.org/10.1109/iitc-amc.2016.7507638
https://doi.org/10.1109/iitc-amc.2016.7507638
Autor:
Yu-Chih Wang, Wenli Collison, Frank Robertson, Paul Farrar, Christopher L. Borst, K. K. W. Lee, Rand Cottle, Greg Akiki, Mark Kelling, Wen-Yu Ku, Lin Pinyen, Sangdong Kwon, David Skilbred, John Lin, Stock Chang
Publikováno v:
2013 IEEE International Electron Devices Meeting.
A close collaboration among IC makers, equipment and material suppliers, facility, and automation providers resulted in better alignment in the technology roadmap and lower development costs for tools and wafers. This would enable the cost-effective
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a1a1e371ad306655a75f88f42ab627a
https://doi.org/10.1109/iedm.2013.6724626
https://doi.org/10.1109/iedm.2013.6724626