Zobrazeno 1 - 10
of 13
pro vyhledávání: '"David Richard Esler"'
Autor:
David Richard Esler
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2021:000041-000047
GE Research has been working on the design, packaging, and testing of SiC Power semiconductors devices at junction temperatures up to 500°C for the past 5 years. Intrinsically, SiC power devices are able to endure and operate reliably at harsh envir
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a669c11d61b6a2b91554b81194ed37a
https://doi.org/10.4071/2380-4491.2021.hitec.000041
https://doi.org/10.4071/2380-4491.2021.hitec.000041
Autor:
David Richard Esler, Ljubisa Dragoljub Stevanovic, Greg Dunne, David Alan Lilienfeld, Stacey Kennerly, Peter Deeb, Peter Almern Losee, Christopher Collazo-Davila, James W. Kretchmer, Alexander Viktorovich Bolotnikov, Thomas Bert Gorczyca
Publikováno v:
Materials Science Forum. 858:876-879
In this paper, we show state of the art, low on-resistance, 25mW/1.2kV and 43mW/2.5kV SiC MOSFETs with excellent design robustness and process control such that the parametric spread of key device characteristics are approaching Si products. The impa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::44e23cb790b39ddf0e66b443f4e60551
https://doi.org/10.4028/www.scientific.net/msf.858.876
https://doi.org/10.4028/www.scientific.net/msf.858.876
Autor:
Brian Lynn Rowden, Fabio Carastro, Rajib Datta, Greg Dunne, Stephen Daley Arthur, David Alan Lilienfeld, Stacey Kennerly, Alexander Viktorovich Bolotnikov, David Richard Esler, Peter Almern Losee, Liangchun Yu, Feng Feng Tao, Maja Harfman-Todorovic, Joseph Lucian Smolenski, Ljubisa Dragoljub Stevanovic, Ravi Raju, Philip Michael Cioffi, Tobias Schuetz
Publikováno v:
Materials Science Forum. 858:894-899
This paper highlights ongoing efforts to validate performance, reliability and robustness of GE SiC MOSFETs for Aerospace and Industrial applications. After summarizing ruggedness and reliability testing performed on 1.2kV MOSFETs, two application ex
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::965d85294bcfed0e1a197e260de04a8b
https://doi.org/10.4028/www.scientific.net/msf.858.894
https://doi.org/10.4028/www.scientific.net/msf.858.894
Autor:
Peter Micah Sandvik, Peter Almern Losee, Brian Lynn Rowden, R. Hristov, Liangchun Yu, Reza Ghandi, David Richard Esler, Jeffrey Scott Erlbaum, Ljubisa Dragoljub Stevanovic, Arun Virupaksha Gowda, Adam Fraser Halverson, Greg Dunne, Alexander Viktorovich Bolotnikov
Publikováno v:
2017 IEEE International Reliability Physics Symposium (IRPS).
SiC MOSFETs have demonstrated continued performance improvement and maturation in the areas of Gate oxide stability and reliability over the past years. While necessary, this alone is not sufficient to achieve reliable high voltage operation. In this
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4dde4433f7ef30f8af36c6ed524a0dd2
https://doi.org/10.1109/irps.2017.7936254
https://doi.org/10.1109/irps.2017.7936254
Autor:
Florian Johannes Schattenmann, Sandeep Tonapi, David Richard Esler, Annita Zhong, Krishnaswami Srihari, Arun Virupaksha Gowda
Publikováno v:
Journal of Electronic Packaging. 128:130-136
One of the key challenges in the thermal management of electronic packages are interfaces, such as those between the chip and heat spreader and the interface between a heat spreader and heat sink or cold plate. Typically, thermal interfaces are fille
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ff18a2bd02e5289d376e454ae094ce19
https://doi.org/10.1115/1.2188952
https://doi.org/10.1115/1.2188952
Autor:
Ryan Christopher Mills, Sandeep Tonapi, Kaustubh Ravindra Nagarkar, Paul Jeffrey Gillespie, David Andrew Simon, Tan Zhang, Prameela Susarla, David Richard Esler
Publikováno v:
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology.
Flip chip packaging is one of the fastest growing segments in electronics packaging technology. The semiconductor packaging industry is continuing to migrate towards Pb-free electronics assembly. Therefore, the development of compatible materials for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7c89356238402d4827e5ef1ee0a59e27
https://doi.org/10.1115/imece2006-13420
https://doi.org/10.1115/imece2006-13420
Autor:
David Richard Esler, K. Nagarkar, Arun Virupaksha Gowda, Sandeep Tonapi, Krishnaswami Srihari, Sara Naomi Paisner
Publikováno v:
Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005..
Thermal interface materials (TIMs) play a key role in the thermal management of microelectronics by providing a path of low thermal impedance between the heat generating devices and the heat dissipating components (heat spreader/sink). Thermal grease
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::357d4b99cf0efe354e6703b98881a95c
https://doi.org/10.1109/stherm.2005.1412160
https://doi.org/10.1109/stherm.2005.1412160
Autor:
David Richard Esler, Arun Virupaksha Gowda, Sandeep Tonapi, Krishnaswami Srihari, K. Nagarkar
Publikováno v:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
One of the key challenges in the thermal management of microelectronic devices is interfaces such as those between the chip and heat spreader and between the heat spreader and heat sink or cold plate. Typically, thermal interfaces are filled with mat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15252815897956dc6574967635d91599
https://doi.org/10.1109/eptc.2004.1396574
https://doi.org/10.1109/eptc.2004.1396574
Autor:
Sandeep Tonapi, R. Mills, Paul Jeffrey Gillespie, John H Campbell, Slawomir Rubinsztajn, David Richard Esler, Krishnaswarmi Srihari, Ananth Prabhakumar
Publikováno v:
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
The assembly and packaging of electronic devices today is becoming increasingly challenging and demanding because of requirements for smaller, faster and lighter products that provide increasing functionality at low cost. These requirements continue
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf626606d60a6fe9c4ea29ec04dd19a4
https://doi.org/10.1109/eptc.2004.1396685
https://doi.org/10.1109/eptc.2004.1396685
Publikováno v:
Advances in Electronic Packaging, Parts A, B, and C.
Measurements and modeling of the thermal resistance of thin (< 100 microns) bond-lines are reported for composite thermal interface materials (TIMs). The composite TIMs consist of alumina particles dispersed in a polymer matrix to form six different
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c661f5f63b83684acaa65aac5058f8dd
https://doi.org/10.1115/ipack2005-73380
https://doi.org/10.1115/ipack2005-73380