Zobrazeno 1 - 5
of 5
pro vyhledávání: '"David Questad"'
Publikováno v:
2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM).
Wafer level chip scale package (WLCSP) is a low cost and high performing packaging format suitable for radio frequency (RF) applications where minimized package size and parasitics are critical. But it raises challenges to reliability. This paper rep
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0355077ee4381904a9bcf575fed335d5
https://doi.org/10.1109/edtm47692.2020.9118036
https://doi.org/10.1109/edtm47692.2020.9118036
Autor:
David Questad, Edmund Blackshear, Manish Nayini, Charles Carey, Zhuo-Jie Wu, Donovan Samantha
Publikováno v:
IRPS
This paper reports a comprehensive CPI study of a large die in 5 different flip chip packaging configurations. Chip corner crack and delamination were observed in temperature cycling stresses. Kerf size effect and substrate effect were studied in det
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d4190ae3655fa84b8e8c76ca488bfd2e
https://doi.org/10.1109/irps.2019.8720530
https://doi.org/10.1109/irps.2019.8720530
Publikováno v:
2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
The current paper describes finite element method based simulations to assess assembly process and thermo-mechanical reliability related risks associated with 2.5D flip chip package and to develop guidelines for an optimal chip layout of a 2.5D packa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15ce8c970fb85ed06c16594425526273
https://doi.org/10.1109/s3s.2018.8640160
https://doi.org/10.1109/s3s.2018.8640160
Autor:
Tunga Krishna R, R. Mendelson, I. Melville, J. Coffin, E. Misra, C. Carey, Thomas A. Wassick, David Questad, Christopher D. Muzzy
Publikováno v:
International Symposium on Microelectronics. 2015:000787-000792
The introduction of low-k & ultra-low-k dielectrics, lead-free (Pb-free) solder interconnects or C4's, and organic flip-chip laminates for integrated circuits have led to some major reliability challenges for the semiconductor industry. These include
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::219daa9071222466a6337f33b1482d77
https://doi.org/10.4071/isom-2015-thp21
https://doi.org/10.4071/isom-2015-thp21
Publikováno v:
Application of Fracture Mechanics in Electronic Packaging.
This paper will review the trends for semiconductors, the impact on electronic products, and the requirements on electronic packaging materials, design, reliability and manufacturing. There is an increasing realization that materials and mechanics pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::095160b0db196adb6c3e7e152bbcf230
https://doi.org/10.1115/imece1997-0515
https://doi.org/10.1115/imece1997-0515