Zobrazeno 1 - 3
of 3
pro vyhledávání: '"David Pinceau"'
Autor:
Christophe Virgilio, Marc Neyens, David Pinceau, Julien Carlier, Philippe Garnier, Lucile Broussous, Bertrand Nongaillard, Mathieu Foucaud, Pierre Campistron, Arnaud Devos
Publikováno v:
ECS Transactions
ECS Transactions, 2015, 69 (8), pp.185-190. ⟨10.1149/06908.0185ecst⟩
ECS Transactions, 2015, 69 (8), pp.185-190. ⟨10.1149/06908.0185ecst⟩
Wet etching in photoresist presence is commonly used in MEMS or integrated circuits manufacturing: metal gates [1], or gate oxides patterning [2]. Nonetheless the resist can’t stand a too long exposure to wet chemicals. Indeed, the liquids diffuse
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::44d3675aa7bd1db8a3cd9c116a46b3e9
https://doi.org/10.1149/06908.0185ecst
https://doi.org/10.1149/06908.0185ecst
Publikováno v:
Microelectronic Engineering
Microelectronic Engineering, Elsevier, 2015, 135, pp.7-12. ⟨10.1016/j.mee.2015.02.024⟩
Microelectronic Engineering, 2015, 135, pp.7-12. ⟨10.1016/j.mee.2015.02.024⟩
Microelectronic Engineering, Elsevier, 2015, 135, pp.7-12. ⟨10.1016/j.mee.2015.02.024⟩
Microelectronic Engineering, 2015, 135, pp.7-12. ⟨10.1016/j.mee.2015.02.024⟩
Display Omitted The stains observed on large photoresist patterns on TiN after SC1 correspond to bumps on the TiN surface.The appearance of these bumps is linked with the oxidation and etching of TiN.The bumps repartition is non-homogeneous on wafers
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::97e543e30c944b8e56ef6753a185d139
https://hal.archives-ouvertes.fr/hal-02100589
https://hal.archives-ouvertes.fr/hal-02100589
Publikováno v:
Sensors and Actuators A: Physical. 115:483-489
Piezoelectric and ferroelectrics films are very promising materials for micro-actuators in MEMS applications. In this paper, we present the fabrication and characterization of silicon membranes actuated by thin piezoelectric films. The influence of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d79eda963c571cc0b06939f7f0329ca6
https://doi.org/10.1016/j.sna.2004.02.011
https://doi.org/10.1016/j.sna.2004.02.011