Zobrazeno 1 - 10
of 15
pro vyhledávání: '"David P. Vallett"'
Autor:
David P. Vallett, Jan Gaudestad
Publikováno v:
International Symposium on Microelectronics. 2014:000635-000640
While microelectronic packages are becoming more and more advanced, the need for non-destructive Electrical Fault Isolation (EFI) becomes ever more critical for the entire product life-cycle ranging from the chip development yield enhancements to fai
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e892a73f6680d7a66b9e167c69f469ed
https://doi.org/10.4071/isom-wp21
https://doi.org/10.4071/isom-wp21
Autor:
Benaiah D. Schrag, Xiaoyong Liu, Jan S. Hoftun, Peter L. Klinger, T.M. Levin, David P. Vallett
Publikováno v:
EDFA Technical Articles. 7:24-31
Magnetic field imaging is proving to be a valuable tool for semiconductor failure analysts and test engineers. One of its main advantages is that it does not require sample preparation or deprocessing because magnetic fields pass through most materia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e73782f7fa9f49b8e8e7f7be70cde4cb
https://doi.org/10.31399/asm.edfa.2005-4.p024
https://doi.org/10.31399/asm.edfa.2005-4.p024
Autor:
David P. Vallett
Publikováno v:
EDFA Technical Articles. 4:5-9
A review of the 2001 edition of the International Technology Roadmap for Semiconductors indicates major obstacles ahead. Of the three basic failure analysis steps—inspection, deprocessing, and fault isolation—the latter is the most at risk, espec
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38833a66a7ce88f91d5fbfbe31887980
https://doi.org/10.31399/asm.edfa.2002-4.p005
https://doi.org/10.31399/asm.edfa.2002-4.p005
Publikováno v:
IBM Journal of Research and Development. 44:583-603
A newly developed optical method for noninvasively measuring the switching activity of operating CMOS integrated circuit chips is described. The method, denoted as picosecond imaging circuit analysis (PICA) can be used to characterize the gate-level
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c4f7b429f993336cf0a99affd948b74e
https://doi.org/10.1147/rd.444.0583
https://doi.org/10.1147/rd.444.0583
Publikováno v:
International Symposium for Testing and Failure Analysis.
Lock-in thermography and magnetic current imaging are emerging as the two image-based fault isolation methods most capable of meeting the challenges of short and open defect localization in thick, opaque assemblies. Such devices are rapidly becoming
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36a0a27e784ca24c4b0f911076b2b24f
https://doi.org/10.31399/asm.cp.istfa2012p0088
https://doi.org/10.31399/asm.cp.istfa2012p0088
Autor:
David P. Vallett, Vladimir V. Talanov, Antonio Orozco, Daniel A. Bader, Nicolas Gagliolo, Jan Gaudestad
Publikováno v:
International Symposium for Testing and Failure Analysis.
Space Domain Reflectometry (SDR) is a newly developed non-destructive failure analysis (FA) technique for localizing open defects in both packages and dies through mapping in space domain the magnetic field produced by a radio frequency (RF) current
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2788be1556283c5f0cab3b5ae30c2e66
https://doi.org/10.31399/asm.cp.istfa2012p0017
https://doi.org/10.31399/asm.cp.istfa2012p0017
Autor:
David P. Vallett
Publikováno v:
International Symposium for Testing and Failure Analysis.
The relative effectiveness of lock-in thermography and magnetic current imaging for identifying defects in packaged ICs was studied by directly comparing results on the same three devices. One known (in-lab fabricated) and two unknown (field return)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::33deb6e1ce2483553efcf8978f3678f7
https://doi.org/10.31399/asm.cp.istfa2011p0146
https://doi.org/10.31399/asm.cp.istfa2011p0146
Autor:
Phillip J. Nigh, David P. Vallett, Donato O. Forlenza, J. Wright, W. Chong, A. Patel, Franco Motika, R. Kurtulik
Publikováno v:
ITC
SEMATECH has sponsored a "test method evaluation" study to understand the trade-offs among the most common test methodologies used in the industry. This paper presents the results of the failure analysis portion of that project. The testing, reliabil
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::79d77f05f2ad67c6e7e06cc3fa01c9a9
https://doi.org/10.1109/test.1999.805883
https://doi.org/10.1109/test.1999.805883
Autor:
David P. Vallett
Publikováno v:
ITC
This paper reviews the logic failure analysis process and the critical need for design-for-diagnostics. The use of flip-chip packaging will render hardware-based diagnostic techniques from the front side of the die obsolete, e.g., liquid crystal, ele
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c32b7afc754f93193aa1205c14c50ccf
https://doi.org/10.1109/test.1996.557160
https://doi.org/10.1109/test.1996.557160
Autor:
Jeffrey A. Kash, Daniel R. Knebel, Phillip J. Nigh, Leendert M. Huisman, Peilin Song, David P. Vallett, Franco Motika, James C. Tsang, Richard F. Rizzolo, Moyra K. McManus, Pia Naoko Sanda
Publikováno v:
ITC
Technological advances such as flip-chip packaging, multiple hierarchical wiring planes, and ultra-high frequencies reduce the effectiveness of conventional diagnostic techniques. It has recently been demonstrated that light pulses emitted during cir
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3aa20ace9286f1e034494a87474e649b
https://doi.org/10.1109/test.1998.743254
https://doi.org/10.1109/test.1998.743254