Zobrazeno 1 - 10
of 239
pro vyhledávání: '"David Locker"'
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Electronics may be required to operate in harsh environments in automotive, aerospace, and defense applications. Solder interconnects in harsh environments may be subjected to extremely-low and high temperatures in the range of −65C to +200C in con
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Autor:
Charles Arvin, Sze Pei Lim, David Locker, Wei Keat Loh, Keith Sweatman, Francis Lee, Masahiro Tsuriya
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Publikováno v:
ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
During operations, handling, and storage in extreme environmental applications including aerospace, defense and automotive, the electronics may be exposed to high and low operating temperatures. In automotive underhood applications, the temperature c
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Exposure to extreme-low environmental temperatures in conjunction with high strain-rates may be encountered by electronics in several harsh-environment applications. Examples include down-hole drilling, aerospace, automotive electronics - which may e
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Extreme environmental applications, including a downhole drilling, aerospace and automotive, may subject the electronics to high-g acceleration in addition to operation at high and low temperatures for extended periods of time. An electronic assembly
Autor:
Charles L. Arvin, Keith Sweatman, Wei Keat Loh, Derek Daily, David Locker, Naoki Kubota, Masahiro Tsuriya, Sze Pei Lim, Ravi Pokhrel
Publikováno v:
2021 International Conference on Electronics Packaging (ICEP).
Materials and processes currently used for 1st level interconnects are reviewed, and possible options for achieving significant reductions in temperatures to which the processor is exposed during packaging are considered. While the low melting point
Publikováno v:
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Electronic components in downhole oil drilling and gas industry applications, automotive and avionics may exposed to high temperatures (> 150°C) and high strain rates (1–100 per sec) during storage, operation and handling which can contribute to t