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High Etch-Resistant Silicon Containing Bilayer Resist:-Lithographic Performance & Outgassing Studies
Autor:
Eric Scott Moyer, Takahashi Hosono, Daisuke Kawana, Kazufumi Sato, Sunlin Hu, Sina Maghoodi, David Lee Wyman, Tomotaka Yamada, Ronald E. Tecklenburg
Publikováno v:
Journal of Photopolymer Science and Technology. 18:365-372
Highly etch resistant poly(silsesquioxane) based resists for ArF lithographic application have been developed. This paper reports on the development of a high etch resistant, high glass transition temperature bilayer resist system capable of imaging