Zobrazeno 1 - 10
of 45
pro vyhledávání: '"David Kopp"'
Autor:
David Kopp
David Kopp's book develops a model of chromatic chord relations in nineteenth-century music by composers such as Schubert, Beethoven, Chopin, Schumann and Brahms. The emphasis is on explaining chromatic third relations and the pivotal role they play
Publikováno v:
How product and manufacturing design enable sustainable companies and societies.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c77ec74307fc104f24784ee4e07e9e3a
https://doi.org/10.35199/norddesign2022.9
https://doi.org/10.35199/norddesign2022.9
Autor:
Jan Breitschuh, Jonas Heimicke, Lars Haertenstein, Albert Albers, Katharina Duehr, David Kopp, Markus Spadinger
Publikováno v:
Procedia CIRP. 84:136-142
Due to globalization and driven by shorter product lifecycles, increasing competition and growing customer demands an ever-increasing number of companies are relying on the advantages of globally distributed development networks in order to deal with
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::989175a33c08f0ce9a0f1163eb07135f
https://doi.org/10.1016/j.procir.2019.04.200
https://doi.org/10.1016/j.procir.2019.04.200
Autor:
David Kopp, David Damschroder
David Kopp has developed new strategies for music analysis that focus especially on relationships between adjacent chords. His reductions of a compositions chordal progressions, shown in music notation or with alphabet letters indicating chordal root
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc89614fb7790632c8eabeb325e5615d
https://doi.org/10.4324/9781315088396-13
https://doi.org/10.4324/9781315088396-13
Autor:
Gary H. Bernstein, Mohammad Ashraf Khan, Quanling Zheng, Patrick Fay, Alfred M. Kriman, David Kopp
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:400-407
We investigate mechanical, thermal, and microwave characteristics of the edge-interconnect scheme called quilt packaging (QP), using a pin transfer method for the application of solder paste. A novel pull test method for QP is introduced, and the pul
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::30c4d064318baf969eaf02a6c337b220
https://doi.org/10.1109/tcpmt.2014.2301738
https://doi.org/10.1109/tcpmt.2014.2301738
Autor:
Edward Beam, Paul Saunier, David Kopp, Patrick Fay, Wayne Johnson, Oleg Laboutin, Tomas Palacios, Yu Cao, Michael L. Schuette, Andrew Ketterson, Dong Seup Lee
Publikováno v:
physica status solidi c. 10:827-830
This paper reports depletion-mode In0.13Al0.83Ga0.04N/GaN high electron mobility transistors (HEMTs) on a SiC substrate with a record current gain cutoff frequency (fT) of 317 GHz. Thanks to the combination of high electron mobility, regrown n+ InGaN
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f35b1cfb7fc78feb691197ec2bc874ce
https://doi.org/10.1002/pssc.201200541
https://doi.org/10.1002/pssc.201200541
Autor:
M. Ashraf Khan, Jason M. Kulick, David Kopp, Patrick Fay, Alfred M. Kriman, Gary H. Bernstein
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 10:8-14
Quilt packaging (QP) is a novel high-speed super-connect (i.e., direct interchip interconnect), developed to improve electrical performance—signal delay, power loss, and so on. Ultrahigh bandwidth has already been demonstrated for QP, but its uniqu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b6760014076f929c542f428da78ccb81
https://doi.org/10.4071/imaps.358
https://doi.org/10.4071/imaps.358
Autor:
Paul S. Price, Rosemary T Zaleski, Moiz Mumtaz, Kevin M. Crofton, Susan P. Felter, Michelle R. Embry, Alan R. Boobis, Robert A. Budinsky, David Kopp, Raymond S. H. Yang, Shanna Collie, Linda K. Teuschler, Keith R. Solomon, Gary Mihlan, Richard C. Hertzberg
Publikováno v:
Critical Reviews in Toxicology. 41:369-383
There is increasing interest in the use of tiered approaches in risk assessment of mixtures or co-exposures to chemicals for prioritization. One possible screening-level risk assessment approach is the threshold of toxicological concern (TTC). To dat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b494e8f68025624503e62c4a53efa6a2
https://doi.org/10.3109/10408444.2010.543655
https://doi.org/10.3109/10408444.2010.543655
Publikováno v:
IEEE Microwave and Wireless Components Letters. 24:29-31
Ultrawide bandwidth coplanar waveguide interconnects between GaAs chips based on a novel fabrication process are demonstrated. Fabricated structures on 100 μm thick GaAs chips exhibited chip-to-chip insertion losses below 1 dB up to 110 GHz, and bel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce325ead2f8ff47117f026e63fa7056b
https://doi.org/10.1109/lmwc.2013.2288181
https://doi.org/10.1109/lmwc.2013.2288181
Autor:
Wolfgang Porod, David Kopp, Gregory L. Snider, Patrick Fay, Zhuowen Sun, Qing Liu, Gary H. Bernstein, Minjun Yan
Publikováno v:
IEEE Transactions on Advanced Packaging. 30:731-740
ldquoQuilt packagingrdquo (QP), a new superconnect paradigm for interchip communication, is presented. QP uses conducting nodules that protrude from the vertical facets of integrated circuits to effect a dense, fast, and reduced-power method of inter
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a880de33cd886214fa3da20bf1e3b776
https://doi.org/10.1109/tadvp.2007.901643
https://doi.org/10.1109/tadvp.2007.901643