Zobrazeno 1 - 3
of 3
pro vyhledávání: '"David J. Lewison"'
Autor:
Eric Schulte, Jason Rowland, Thomas E. Lombardi, David J. Lewison, Kang-Wook Lee, Katsuyuki Sakuma
Publikováno v:
International Symposium on Microelectronics. 2015:000725-000729
Tin alloys are widely used as solder for electronic interconnections. Tin solder surfaces tend to have tin oxides which need to be removed to improve the yield of interconnection reflow processes such as flip chip joining. Conventionally, a strong fl
Autor:
Edmund Blackshear, Benjamin V. Fasano, Brian W. Quinlan, Yoichi Miyazawa, Tomoyuki Yamada, Richard Alan Heath, Paul Fortier, Frederick H. Roy, Hugues C Gagnon, David J. Lewison, Itsuroh Shishido, Elaine Cyr Takashi Nakajima, Shidong Li
Publikováno v:
International Symposium on Microelectronics. 2014:000074-000080
Coreless flip chip laminate substrates have shown significant advantages over cored versions in terms of wireability due to the absence of large coarse pitch core vias and accompanying via lands. Resistance to widespread acceptance of coreless has be
Autor:
Benjamin V. Fasano, Richard F. Indyk, Brittany Hedrick, Franklin M. Baez, Jorge Lubguban, Michael S. Cranmer, Shidong Li, Luc Guerin, Sarah H. Knickerbocker, David J. Lewison, Marc Phaneuf Luc Ouellet, Ian D. Melville, Koushik Ramachandran, Charles L. Arvin, Maryse Cournoyer, Daniel Berger, Christopher L. Tessler, John J. Garant, Matthew Angyal, Jean Audet, Vijay Sukumaran, Subramanian S. Iyer
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
The processes key to enabling 3D manufacturing, namely, bond, backgrind, and through silicon via (TSV) reveal, are extended for 300 mm glass substrates to fabricate a heterogeneous, multi-die, 2.5D glass interposer. Based on an existing silicon inter