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Autor:
Vincent Beix, Marion Volpert, Adrien Gasse, Thomas Lacave, Abdenacer Ait-Mani, Brigitte Soulier, Pamela Rueda, Patrick Peray, Frederic Mercier, David Henry Francois Levy, Bertrand Chambion, Aurelie Vandeneynde
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
TSV first or TSV last are technologies used in 3D packaging, that are now well described in the literature. However there is still room for some improvement especially in the field of TSV isolation. Certain applications such as power applications or
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::850ec6f37cb66ef6e7b24338acce7b2a
https://doi.org/10.1109/estc.2018.8546496
https://doi.org/10.1109/estc.2018.8546496
