Zobrazeno 1 - 7
of 7
pro vyhledávání: '"David H. Eppes"'
Autor:
David H. Eppes, Jacob Wilcox, Mike Bruce, R.M. Ring, Paiboon Tangyunyong, Victoria J. Bruce, Edward I. Cole, C.F. Hawkins
Publikováno v:
The 16th Annual Meeting of the IEEE Lasers and Electro-Optics Society, 2003. LEOS 2003..
Soft defects in integrated circuits (ICs) are defined as failures when the IC is partially functional, but will not operate properly under all specified conditions - these conditions may be within or outside normal limits. To address soft defects, a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d2d2d979cb6180a2035117421e53e2d0
https://doi.org/10.1109/leos.2003.1252974
https://doi.org/10.1109/leos.2003.1252974
Autor:
Victoria J. Bruce, W.-L. Chong, D.A. Benson, Daniel L. Barton, C.F. Hawkins, David H. Eppes, C.L. Henderson, Jacob Wilcox, Mike Bruce, R.M. Ring, J.M. Soden, Paiboon Tangyunyong, Edward I. Cole
Publikováno v:
The 16th Annual Meeting of the IEEE Lasers and Electro-Optics Society, 2003. LEOS 2003..
Defect localization in modern ICs can be extremely challenging. To address this complexity several optically based methodologies have been developed over the past decade. These techniques will be described demonstrating their utility in locating defe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85c114fe32cc390787ba165674fa49da
https://doi.org/10.1109/leos.2003.1252911
https://doi.org/10.1109/leos.2003.1252911
Autor:
Charles F. Hawkins, David H. Eppes, Michael R. Bruce, Victoria J. Bruce, Jacob Wilcox, Edward I. Cole, Paiboon Tangyunyong
Publikováno v:
International Symposium for Testing and Failure Analysis.
We have developed a new scanning laser microscopy methodology, Soft Defect Localization (SDL), that directly locates soft defects from the front side and backside of an IC. The method combines localized laser heating with the pass/fail state of a dev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1018471257ee869427796440696e4e57
https://doi.org/10.31399/asm.cp.istfa2002p0021
https://doi.org/10.31399/asm.cp.istfa2002p0021
Publikováno v:
2015 IEEE 22nd International Symposium on the Physical & Failure Analysis of Integrated Circuits; 2015, p13-16, 4p
Autor:
Bruce, M.R., Bruce, V.J., Eppes, D.H., Wilcox, J., Cole, E.I., Jr., Tangyunyong, P., Hawkins, C.F., Ring, R.
Publikováno v:
16th Annual Meeting of the IEEE Lasers & Electro-Optics Society, 2003 (LEOS 2003); 2003, p662-662, 1p
Autor:
Cole, E.I., Jr., Bruce, M.R., Barton, D.L., Tangyunyong, P., Bruce, V.J., Hawkins, C.F., Soden, J.M., Henderson, C.L., Ring, R.M., Chong, W.-L., Eppes, D.H., Wilcox, J., Benson, D.A.
Publikováno v:
16th Annual Meeting of the IEEE Lasers & Electro-Optics Society, 2003 (LEOS 2003); 2003, p537-537, 1p
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
