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pro vyhledávání: '"David E. Ludwig"'
Autor:
David E. Ludwig
Publikováno v:
SPIE Proceedings.
ISC has developed an unique form of bump bonding based on a plug and socket concept which allows high density reflow solder array interconnects. Solder bumps with diameters of 50 microns and heights of 15 microns are plugged into sockets of photo def
Autor:
J. Arnold, David E. Ludwig
Publikováno v:
SPIE Proceedings.
Visible and infrared focal planes are becoming ever larger and more complicated, but the real estate for unit cell electronics is diminishing. Applications such as High Definition Television require very large format focal plane arrays and complex po
Autor:
Michael Skow, David E. Ludwig
Publikováno v:
SPIE Proceedings.
ISC has completed test on an IC which has 32 channels of amplifiers, low pass anti-aliasing filters, 13-bit analog-to-digital (A/D) converters with non-uniformity correction per channel and a digital multiplexer. The single slope class of A/D convers
Autor:
Stuart N. Shanken, David E. Ludwig
Publikováno v:
Ultrahigh- and High-Speed Photography, Videography, Photonics, and Velocimetry '90.
Z-Plane memory packaging technology utilizes the process of stacking integrated circuits (ICs) to each other in order to increase packaging density. This paper will discuss how Z-plane technology can be applied to memory systems used in high frame-ra
Autor:
David E. Ludwig
Publikováno v:
SPIE Proceedings.
This paper provides an overview of the current state-of-the-art HYMOSS (Hybrid Mosaic On Stacked Silicon) Z-technology. In the first part of this paper, an introduction to the HYMOSS physical characteristics is presented. This includes a description
Autor:
David E. Ludwig, Ronald J. Indin
Publikováno v:
SPIE Proceedings.
Design approaches to tactical air defense are outlined. A SAM and an air-to-air missile trajectory are used to optimize a system design for maximum target detection range, taking system noise and background clutter noise into account. Detection range
Autor:
David E. Ludwig
Publikováno v:
SPIE Proceedings.
The fabrication of the first Z-technology module with 128 active layers of readout electronic circuitry is being pursued. Several issues which will be investigated regarding the 128-layer module build, such as photolithographic processing at the edge
Autor:
Iannuzzi, Timothy J.1 TJI@bbl-inc.com, Tina N. Armstrong1, John B. Thelen1, David E. Ludwig1, Clifford E. Firstenberg2
Publikováno v:
Human & Ecological Risk Assessment. Apr2004, Vol. 10 Issue 2, p389-413. 25p.
Publikováno v:
SPIE Proceedings.
Z-technology utilizes the process of stacking integrated circuits (ICs) to achieve a high degree of packaging density. This technique has been most commonly applied to packaging read out electronics for infrared (IR) focal plane arrays to achieve mor
Publikováno v:
SPIE Proceedings.
Hardware fabrication has been initiated on a test IC which has 32 channels of amplifiers, low pass anti-aliasing filters, 13-bit analog-to-digital (ND) converters per channel and a digital multiplexer. The single slope class of ND conversion is descr