Zobrazeno 1 - 4
of 4
pro vyhledávání: '"David Byrum Hicks"'
Publikováno v:
14th Automotive Materials Conference: Ceramic Engineering and Science Proceedings, Volume 8, Issue 9/10
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c1c68693b09bdee9aef74ce0188279bf
https://doi.org/10.1002/9780470320419.ch9
https://doi.org/10.1002/9780470320419.ch9
Publikováno v:
Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95.
Polyimide, polymethylmethacrylate (PMMA) and polyester-based polymers were investigated as potential electroplating mold materials. They showed high tensile stress (/spl equiv/10/sup 8/ dyne/cm/sup 2/) after heat treatment at temperatures /spl ges/ 2
Publikováno v:
SPIE Proceedings.
Electroformed nickel resonators were constructed and tested in the temperature range of - 40 to 110 degrees C. The temperature sensitivities of the resonant frequencies are - 150 ppm/degrees C, - 200 ppm/degrees C, and - 3000 ppm/degrees C for cantil
Autor:
Jayant K. Bhagat, David Byrum Hicks
Publikováno v:
Journal of Applied Physics. 61:3118-3120
Using concepts of solid‐phase epitaxy, a sealed and structurally sound bond between two silicon wafers has been achieved with aluminum, platinum silicide, or germanium as the transport medium. Only in the case of aluminum did microprobe analysis sh