Zobrazeno 1 - 10
of 59
pro vyhledávání: '"David Bušek"'
Autor:
Agata Skwarek, Halim Choi, Tamás Hurtony, Jaeduk Byun, Ahmad Azmin Mohamad, David Bušek, Karel Dušek, Balázs Illés
Publikováno v:
Nanomaterials, Vol 14, Iss 20, p 1636 (2024)
This study investigates the mechanism and effects of incorporating different ZrO2 nano-particles into SAC0307 solder alloys. ZrO2 nano-powder and nano-fibers in 0.25–0.5 wt% were added to the SAC0307 alloy to prepare composite solder joints by surf
Externí odkaz:
https://doaj.org/article/56374fb45aa448f5aa0a5b7afd415d22
Publikováno v:
Case Studies in Thermal Engineering, Vol 57, Iss , Pp 104315- (2024)
During vapour phase reflow soldering used in electronics manufacturing, the process control of ovens is usually based on temperature measurements, which can be insufficient due to the saturation differences in the temperature and the vapour concentra
Externí odkaz:
https://doaj.org/article/4f9bb3e00b3546f0a8bc32eff3c36228
Publikováno v:
Materials, Vol 17, Iss 11, p 2693 (2024)
This study presents a new approach to investigating the impact of repeated reflow on the failure of ball grid array (BGA) packages. The issue with the BGA package collapse is that the repeated reflow can lead to short circuits, particularly for BGAs
Externí odkaz:
https://doaj.org/article/e891d8a188904db897099bf6aa64ff74
Publikováno v:
Journal of Materials Research and Technology, Vol 20, Iss , Pp 4231-4240 (2022)
The main joining process of the electronic industry is still soldering with different alloys of Sn. This work studied the relationship between Sn whisker growth and corrosion resistance of 99Sn0.3Ag0.7Cu–TiO2/ZnO (0.25wt%) composite solder alloys i
Externí odkaz:
https://doaj.org/article/b89dad20fd34482daca066ea9c86c613
Autor:
Attila Géczy, Gergő Havellant, Réka Bátorfi, Agata Skwarek, Karel Dušek, David Bušek, Balázs Illés
Publikováno v:
Materials, Vol 16, Iss 3, p 903 (2023)
The COVID-19 outbreak increased demand for personal protective respirator masks. Textile masks based on cloth materials appeared to be a sustainable, comfortable, and cost-effective alternative available in global communities. In this study, we used
Externí odkaz:
https://doaj.org/article/cf85c79407ee45feb130a7bafe17e641
Publikováno v:
Metals, Vol 12, Iss 1, p 121 (2022)
Sn–Bi alloys are desirable candidates for soldering components on printed circuit boards (PCBs) because of their low melting point and reduced cost. While certain tin–bismuth solders are well characterized many new alloys in this family have been
Externí odkaz:
https://doaj.org/article/df3e82efe9c94800b19ecd44db1faa77
Publikováno v:
Polymers, Vol 13, Iss 23, p 4213 (2021)
This work presented an FEM (finite element method) mathematical model that describes the temperature distribution in different parts of a 3D printer based on additive manufacturing process using filament extrusion during its operation. Variation in p
Externí odkaz:
https://doaj.org/article/d748ec900bd943a9b189c8ef5adda383
Autor:
Karel Dušek, Petr Veselý, David Bušek, Adam Petráč, Attila Géczy, Balázs Illés, Oliver Krammer
Publikováno v:
Materials, Vol 14, Iss 24, p 7909 (2021)
Flux contained in solder paste significantly affects the process of solder joint creation during reflow soldering, including the creation of an intermetallic layer (IML). This work investigates the dependence of intermetallic layer thickness on ROL0/
Externí odkaz:
https://doaj.org/article/563820af12054a5f89dfc5d8dd866fa1
Autor:
Slavomír KARDOŠ, David BUŠEK
Publikováno v:
Acta Electrotechnica et Informatica, Vol 17, Iss 3, Pp 17-21 (2017)
The work is aimed at visualization of working principles of microelectromechanical sensors which are used in automobile electronic systems. Attention is paid to accelerometric, inclinometric, pressure and MAF devices. These are used in systems for
Externí odkaz:
https://doaj.org/article/7ea1522326a64d08a7a7a5c0f7441e88
Publikováno v:
Ceramics International.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::021596a5ba770d5573ee0c87ba177871
https://doi.org/10.1016/j.ceramint.2023.04.216
https://doi.org/10.1016/j.ceramint.2023.04.216