Zobrazeno 1 - 10
of 50
pro vyhledávání: '"David, Michal"'
Publikováno v:
'Atiqot / עתיקות, 2024 Jan 01. 114, 193-212.
Externí odkaz:
https://www.jstor.org/stable/27309860
Publikováno v:
IET Science, Measurement & Technology, Vol 18, Iss 3, Pp 103-115 (2024)
Abstract This research discusses the effects of large round‐off errors on the performance of control charts for means when a process is normally distributed with a known variance and a fixed sample size. Quality control in practice uses control cha
Externí odkaz:
https://doaj.org/article/24c3f27797e24c3389ecfcd0cd5781df
Publikováno v:
In Journal of Arid Environments October 2024 224
Publikováno v:
Power Electronic Devices and Components, Vol 7, Iss , Pp 100059- (2024)
This article addresses the soldering of larger components onto ceramic substrates with thick printed copper patterns with a reduced amount of flux or using glutaric acid as a flux substitute. The main goal of the research was to create high quality c
Externí odkaz:
https://doaj.org/article/efc9676535994b57a7e09fb112898f2b
Autor:
Tal, Oren, Piasetzky-David, Michal
Publikováno v:
Israel Exploration Journal, 2020 Jan 01. 70(1), 106-113.
Externí odkaz:
https://www.jstor.org/stable/27100279
Akademický článek
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Publikováno v:
In Journal of School Psychology February 2012 50(1):7-36
This paper examines two methods of assembling electronics SMD components on flexible substrates with low-temperature resistance. As a contact medium for interconnection between component and conductive pattern, conductive adhesive MG Chemicals 8331S-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ae06ad7e1429cdb5c51317640b3a31c4
http://hdl.handle.net/11025/49770
http://hdl.handle.net/11025/49770
This paper deals with analysis, testing, and process optimization of new nanoparticle silvering paste with high silver content. Specifically, on ceramic substrates with printed conductive patterns created by thick film technology. Sintering is curren
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3b3300cf1c911a68c0d8d8a8b711e99d
http://hdl.handle.net/11025/49767
http://hdl.handle.net/11025/49767