Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Dashun Liu"'
Publikováno v:
Scientific Reports, Vol 14, Iss 1, Pp 1-17 (2024)
Abstract Pressure-sensitive adhesives (PSAs) are crucial for the structural and functional integrity of flexible displays. Investigating the intricate mechanical properties of PSAs can help enhance product quality and performance. This study conducts
Externí odkaz:
https://doaj.org/article/df4dcfe4c8864474b401dcc1134ac790
Publikováno v:
STAR Protocols, Vol 5, Iss 1, Pp 102907- (2024)
Summary: Here, we present a finite element method-based scheme for solving coupled partial differential equations (PDEs) for the analysis of lithiation-induced stress in largely deformed spherical nanoparticles via the PDE module in COMSOL. We descri
Externí odkaz:
https://doaj.org/article/fa4d2a0a49a04036a9c8417e712f6f4f
Publikováno v:
Applied Sciences, Vol 14, Iss 4, p 1636 (2024)
Black shale, as a type of soft rock, exhibits high strength when freshly exposed. However, it easily disintegrates upon contact with water, making it unsuitable for direct use in roadbed construction. Using it as discarded material not only increases
Externí odkaz:
https://doaj.org/article/c52213ae79104e75ae89a5f06a5004eb
Publikováno v:
Results in Physics, Vol 16, Iss , Pp 103018- (2020)
The cylindrical core-shell electrode is regarded as one of the promising electrodes for lithium-ion batteries (LIBs) due to its high capacity and stable electrochemical performance. However, owning to the intrinsic structural characteristics of the c
Externí odkaz:
https://doaj.org/article/600727e33f7e45218b4ce35335d8c4fc
Publikováno v:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Publikováno v:
In Rare Metal Materials and Engineering January 2014 43(1):42-46
Autor:
Richeng Liu, Jingshen Wu, Kai Chen, Ke Xue, Dong Lu, Dashun Liu, Yong Zhong, Zhaorong Wan, Yijing Qin
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
With the development of electronic packaging technology, devices become much smaller size and higher integration, and the reliability of devices has become one of the most concerned issues. Interfacial delamination has become one of the significant f
Autor:
Yijing Qin, Dong Lu, Dashun Liu, Jingshen Wu, Yong Zhong, Ke Xue, Zhaorong Wan, Richeng Liu, Kai Chen
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
With the development of electronic packaging technology in 5G era, System-in-Package (SiP) module is developing into smaller size and higher integration to realize the multi-functional applications, and the reliability of SiP module, especially the i
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
Delamination is a common failure mode and widely concerned in microelectronic package. In this paper, we focus on the underfill/Si interface in flip-chip package. To predict the risk of delamination, a modified button shear test with pre-delamination
Publikováno v:
RTAS
With the continuous development of network communication and Internet of Things technology, the smart factory of new energy vehicles is increasingly dependent on network communication technology. Due to its increasing openness, which leads to increas